Aqueous Light-Release Agent Composition for Semiconductor Lamination

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Solution Overview

Problem

Existing release agent compositions for semiconductor wafers and electronic device layers rely on organic solvents, which pose environmental and safety hazards, and there is a need for a composition that can adhere firmly during processing and easily separate by light irradiation.

Innovation Solution

A release agent composition using an aqueous solvent with a light-absorbing compound, such as polyphenol-based compounds, to form a release layer that can be easily separated by light irradiation, allowing for secure adhesion and separation of semiconductor or electronic device layers from a support substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a release agent composition containing organic solvent is used, then the adhesion and separation performance can be achieved, but environmental and safety hazards occur

Engineering Contradiction:

Improveadhesion and separation performanceVSAvoidenvironmental and safety hazards

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the solvent parameter from organic to aqueous, fundamentally altering the chemical composition while maintaining the functional performance of adhesion and light-irradiation separation. This parameter change eliminates the harmful effects of organic solvents while preserving the essential release agent functionality.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs a disposable release agent layer that is applied, serves its temporary adhesion function, and then is easily removed by light irradiation. This approach eliminates the need for complex removal processes and avoids environmental contamination from solvent residues, aligning with the goal of reducing harmful factors.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Volume of moving object

If the thickness of the substrate is reduced to reduce package size, then the package size is reduced, but the substrate strength is reduced and it is likely to be damaged during processing

Engineering Contradiction:

Improvepackage sizeVSAvoidsubstrate strength

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent introduces a release agent layer as an intermediary between the thin substrate and the support. This intermediary provides mechanical support and protection during processing, enabling the substrate to be handled safely despite its reduced thickness, while still allowing for easy separation through light irradiation after processing.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The release agent layer is applied in advance before substrate processing, creating a protective configuration that enables safe handling of thin substrates. The preliminary application of the release agent allows the thin substrate to withstand processing stresses without damage.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition enables safe, efficient, and environmentally friendly adhesion and separation of semiconductor or electronic device layers, reducing the need for organic solvents and minimizing environmental impact.

Implementation Method 1

the release agent layer absorbs light irradiated from the support substrate side

Methodology Applied

Scientific EffectLight absorption: Absorption (EM radiation)

Data Source

PatentUS20250340759A1Release agent composition for light irradiation release

Publication Date: 2025.11.06 NISSAN CHEM CORP

AI summary

A release agent composition for light irradiation release for forming a release agent layer of a laminate which includes a semiconductor substrate or an electronic device layer, a light-transmissive support substrate, and a release agent layer provided between the semiconductor substrate or the electronic device layer and the support substrate, in which the electronic device layer includes a plurality of semiconductor chip substrates and a sealing resin disposed between the semiconductor chip substrates, and which is used for releasing the semiconductor substrate or the electronic device layer from the support substrate after the release agent layer absorbs light irradiated from the support substrate side, in which the release agent composition contains a light-absorbing compound that contributes to making the semiconductor substrate or the electronic device layer and the support substrate easily released by absorbing the light, and a solvent, and the solvent contains water.