Aqueous Metal Complex Composition for Stable Thin Film Deposition
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Solution Overview
Problem
Conventional metal complexes used in chemical vapor deposition have high thermal stability, leading to poor solubility in aqueous solvents, flammability issues, and storage stability problems, resulting in irregularities on thin film surfaces.
Innovation Solution
A composition containing specific metal complexes with tailored ligands for improved solubility in aqueous solvents, stored under controlled conditions to prevent precipitation, using a method that includes filling a container with a specific void ratio and oxygen concentration, and storing at controlled temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional metal complexes with bulky ligand substituents are used to impart thermal stability, then thermal stability is improved, but solubility in aqueous solvents deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the ligand by introducing water-soluble groups (carboxyl, hydroxyl, amino, or carbonyl groups) that can form hydrogen bonds with water molecules. This parameter change enables the metal complex to dissolve in aqueous solvents while maintaining thermal stability through the coordinated ligand structure.
Solution Approach 2:
The patent creates a composite structure by combining metal complexes with water-soluble ligands. The ligand contains both the coordinated portion (providing thermal stability) and the water-soluble portion (providing aqueous solubility), forming a composite molecular structure that achieves multiple properties simultaneously.
2Quantity of substance
If organic solvents are used to dissolve metal complexes, then solubility is improved, but flammability increases
Solution Approach 1:
The patent changes the solvent parameter from organic to aqueous by modifying the ligand to contain water-soluble groups. This parameter change eliminates flammability (inherent property of water) while maintaining solubility through hydrogen bonding interactions between the ligand and water molecules.
3Object-affected harmful factors
If the amount of organic solvent is reduced to improve safety, then flammability is reduced, but solubility deteriorates and metal complexes precipitate
Solution Approach 1:
The patent fundamentally changes the solvent type parameter from organic to aqueous, which eliminates flammability while maintaining solubility through hydrogen bonding. This parameter change allows complete elimination of organic solvents without causing precipitation.
4Object-affected harmful factors
If metal complexes are stored in aqueous solvents, then flammability is reduced, but storage stability deteriorates due to precipitation
Solution Approach 1:
The patent modifies the ligand parameter to include water-soluble groups that form hydrogen bonds with water, enabling stable dissolution in aqueous solvents. This parameter change maintains storage stability by preventing precipitation while retaining the flammability advantage of aqueous storage.
Data Source
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AI summary
The composition contains: at least one compound selected from the group consisting of a first compound represented by formula (2) and a second compound having a metal atom and a ligand represented by formula (1); and an aqueous solvent.