Aqueous Resist Rinse Composition for Pattern Collapse Control
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Solution Overview
Problem
Current electronic device manufacturing processes face challenges such as resist pattern defects, bridge formation, pattern collapse, width non-uniformity, residue after solution removal, high surface tension, environmental impact, handling risks, and storage stability issues in the production of fine resist patterns.
Innovation Solution
An electronic device manufacturing aqueous solution comprising an alkylcarboxylic acid compound and water, with optional nitrogen-containing, hydroxy-containing, and surfactant components, is used to improve resist pattern formation and stability, reducing defects and surface tension while enhancing storage stability and environmental safety.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional rinse liquids containing surfactants are used, then pattern collapse margin and defect performance are improved, but surface tension remains high and environmental impact increases
Solution Approach 1:
The invention changes the chemical composition parameters by using alkylcarboxylic acid compounds (C3-C12) instead of conventional surfactants. This parameter change achieves lower surface tension (20-40 mN/m) while maintaining pattern collapse resistance, directly resolving the contradiction between reliability and harmful factors.
Solution Approach 2:
The invention creates a composite aqueous solution combining alkylcarboxylic acid compounds with specific additives (nitrogen-containing compounds, hydroxy-containing compounds, and surfactants) to achieve synergistic effects. This composite approach maintains pattern collapse margin while reducing surface tension and environmental impact.
2Manufacturing precision
If finer resist patterns are formed by short wavelength exposure, then resolution is improved, but pattern collapse and yield decrease
Solution Approach 1:
The invention changes the chemical parameters of the rinse liquid by using specific alkylcarboxylic acid compounds with optimized carbon chain lengths (C3-C12). This enables effective rinsing of finer patterns without causing collapse, resolving the contradiction between manufacturing precision and reliability.
Solution Approach 2:
The alkylcarboxylic acid compound acts as an intermediary substance that facilitates the rinsing process for fine patterns. It mediates between the water and the resist pattern surface, providing adequate wetting and protection without direct contact damage, thus enabling high resolution while preventing collapse.
3Object-generated harmful factors
If aqueous solutions with low surface tension are used, then residue after removal is reduced, but storage stability deteriorates
Solution Approach 1:
The invention formulates a composite aqueous solution containing alkylcarboxylic acid compounds combined with nitrogen-containing compounds, hydroxy-containing compounds, and surfactants. This composite structure achieves low surface tension (20-40 mN/m) for reduced residue while the synergistic combination ensures storage stability, resolving the contradiction between harmful factors and composition stability.
Solution Approach 2:
The invention applies different functional components at optimized concentrations within the aqueous solution. The alkylcarboxylic acid compound provides low surface tension locally at the liquid surface, while the combined formulation maintains bulk solution stability during storage, resolving the contradiction between surface properties and overall stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces defects, prevents pattern collapse, and improves storage stability while minimizing environmental impact and handling risks, achieving better resist pattern uniformity and reduced surface tension.
Implementation Method 1
reducing the surface tension of an electronic device manufacturing aqueous solution
Implementation Method 2
preventing resist pattern collapse in fine resist patterns
Data Source
AI summary
[Problem] To provide an electronic device manufacturing aqueous solution, which makes it possible to prevent pattern collapse or suppress non-uniformity of resist pattern width. [Means for Solution] An electronic device manufacturing aqueous solution comprising an alkylcarboxylic acid compound (A) and a solvent (B), wherein the alkylcarboxylic acid compound (A) is represented by the formula (a): A1-COOH (a), wherein A1 is C3-12 alkyl, and the solvent (B) comprises water.