AR Lens Assembly Thickness Reduction via Direct Wiring Layer Bonding

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Solution Overview

Problem

The existing lens assemblies in AR glasses are thick due to the inclusion of an auxiliary structure between the waveguide substrate and the wiring layer, which compromises the thinness of the lens.

Innovation Solution

The lens assembly eliminates the need for an auxiliary structure by directly disposing the wiring layer on the waveguide substrate, simplifying the processing procedure and reducing the overall thickness of the lens.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an auxiliary structure made of resin is provided between the waveguide substrate and the wiring layer, then the waveguide substrate is protected and debonding is avoided, but the lens becomes thicker

Engineering Contradiction:
Improveprotection of waveguide substrateVSAvoidthickness of lens
Core Design Contradiction:
ReliabilityVSLength of stationary object

Solution Approach 1:

The patent removes the auxiliary resin structure from the lens assembly, extracting the problematic component that caused thickness increase while maintaining the essential protective function through direct bonding of the wiring layer to the waveguide substrate

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the protective function with the structural bonding by directly disposing the wiring layer on the waveguide substrate, combining the protection function and structural support into a single integrated configuration without separate auxiliary layers

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If an auxiliary structure is provided between the waveguide substrate and the wiring layer, then debonding is avoided, but the processing procedure becomes more complex

Engineering Contradiction:
Improveprevention of debondingVSAvoidprocessing procedure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts and eliminates the auxiliary resin structure from the processing sequence, simplifying the manufacturing procedure by reducing the number of layers that need to be handled, bonded, and processed during fabrication

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the protective function and structural bonding into a single direct bonding step, merging multiple functions into one simplified processing operation that reduces overall manufacturing complexity

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS12287478B2Lens assembly and augmented reality glasses
Publication Date: 2025.04.29 ASPHETEK SOLUTION (CHENGDU) LTD
  • US12287478B2 patent drawing
  • US12287478B2 patent drawing
  • US12287478B2 patent drawing

AI summary

A lens assembly and Augmented Reality (AR) glasses, including a waveguide substrate, a wiring layer, a protective layer, an eye tracking component, and a lens. The waveguide substrate includes a first surface. The wiring layer is disposed on the first surface. The protective layer is disposed on the first surface and covering the wiring layer. The eye tracking component is disposed in the protective layer and is electrically connected with the wiring layer for tracking position of an eyeball. The lens is connected to a side of the protective layer away from the waveguide substrate. The AR glasses includes a display device and two lens assemblies. The display device is positioned between the two lens assemblies for emitting image light to the waveguide substrates of the two lens assemblies.