AR Overlay for PCB Failure Analysis
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Solution Overview
Problem
In failure analysis of electronic devices, particularly printed circuit boards, the increasing packaging density and reduced space for part information make it difficult for field engineers to identify faulty components, as traditional methods like silk printing are insufficient, leading to challenges in obtaining necessary details directly from the board.
Innovation Solution
An information processing apparatus and method that uses augmented reality (AR) to superimpose and display information about specific parts or wires on a captured image of a printed circuit board, allowing field engineers to easily identify potential failure causes by highlighting and providing details of specified components using a processor and camera system connected via a wireless link.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If information related to all parts and wires on the printed circuit board is superimposed and displayed on the captured image, then complete failure analysis information is provided, but it becomes difficult to identify the specific faulty component due to information overload
Solution Approach 1:
The patent segments the failure analysis information by separating faulty parts/wires from non-faulty parts/wires. The processor identifies specific faulty components based on failure information and selectively superimposes display information only for those faulty components, rather than displaying all components. This segmentation resolves the contradiction by providing complete failure analysis information while avoiding information overload that would hinder faulty component identification.
2Area of stationary object
If packaging density is increased to reduce board space, then space efficiency is improved, but the space for part information is reduced making it difficult to identify components
Solution Approach 1:
The patent transitions information display from the two-dimensional physical board surface to the three-dimensional augmented reality space. By superimposing part information on the captured image of the densely packed board, the system provides part information in an additional dimensional layer without requiring physical space on the board itself. This resolves the contradiction by maintaining high packaging density while preserving access to part information through AR overlay.
3Ease of manufacture
If traditional silk printing methods are used to provide part information, then manufacturing simplicity is maintained, but the information is insufficient for identifying faulty components in densely packed boards
Solution Approach 1:
The patent introduces an intermediary system consisting of the processor and display device that bridges the gap between traditional silk printing and component identification. The processor captures images of the board, identifies faulty components based on failure information, and superimposes targeted display information on the captured image. This intermediary AR system resolves the contradiction by maintaining the simplicity of traditional manufacturing while providing precise component identification capability.
Data Source
AI summary
An information processing apparatus includes a processor configured to: obtain failure information to identify details of a failure which has occurred in a target device on which failure analysis is to be performed; and superimpose and display information related to a part or a wire on a captured image of a printed circuit board included in the target device, the part or the wire being a possible cause for the failure identified by the failure information from multiple parts and wires disposed on the printed circuit board.