Vacuum Arc Deposition Target Rotation for Stable Discharge
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Solution Overview
Problem
In vacuum arc deposition methods, the formation of an arc spot at the target's end portion leads to instability, non-uniform deposition rates, and potential discharge extinction, while forming the arc spot at non-end portions results in large steps that also destabilize the arc position.
Innovation Solution
A deposition method and apparatus that change the arc discharge position on the target's surface, using a striker to induce arc discharge on the target's side surface, allowing for continuous deposition without trimming, and a control unit to adjust the striking position and reduce the affected area as the target is used.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If the arc spot is formed at the end portion of the target, then the deposition process can continue, but the arc discharge becomes unstable and may be extinguished
Solution Approach 1:
The patent applies dynamics by making the target rotatable about its central axis, allowing the arc discharge position to be dynamically changed during deposition. The target rotation enables the arc spot to move from the end portion to non-end portions (such as the cylindrical side surface or flat surface), maintaining arc discharge stability while continuing deposition without trimming the target.
2Reliability
If the arc spot is formed at non-end portions of the target, then arc discharge stability improves, but large steps are formed between the end portion and non-end portion
Solution Approach 1:
The patent uses dynamics to rotate the target, enabling the arc discharge to occur on non-end portions (cylindrical side surface or flat surface) while the target rotates. This dynamic approach allows deposition to proceed on stable surfaces without forming large steps, as the rotation distributes the erosion more uniformly and prevents localized deep recess formation.
Solution Approach 2:
The patent transitions from two-dimensional end-surface deposition to three-dimensional deposition by utilizing the cylindrical side surface or flat surface of the target. By changing the deposition dimension from the end face to the side surface or top surface, the arc discharge can occur on non-end portions without creating problematic steps, improving both stability and surface uniformity.
3Reliability
If the upper surface of the target is trimmed to maintain flatness, then arc discharge stability improves, but target use efficiency decreases and productivity lowers
Solution Approach 1:
The patent eliminates the need for trimming by implementing target rotation. The dynamic rotation allows the arc discharge to occur on non-end portions where erosion does not create deep recesses requiring trimming. This maintains arc discharge stability throughout the entire target lifespan, maximizing target use efficiency and productivity without intermittent trimming operations.
Solution Approach 2:
The patent achieves continuous deposition without interruption for trimming by rotating the target and performing arc discharge on non-end portions. The useful action of film formation continues uninterrupted, as the target rotation prevents the formation of deep recesses that would otherwise require trimming to maintain arc discharge stability.
4Productivity
If the target is used without trimming, then productivity improves, but chips may enter the driving unit and cause troubles
Solution Approach 1:
The patent uses target rotation to perform arc discharge on non-end portions, which prevents the formation of deep recesses and significant chip generation. The dynamic deposition process on the cylindrical side surface or flat surface produces minimal chips that are less likely to enter the driving unit, maintaining continuous operation capability without the need for trimming.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the arc discharge, maintains uniform deposition rates, and extends the target's usage efficiency by avoiding the need for trimming, thus enhancing productivity and reducing maintenance costs.
Implementation Method 1
induce arc discharge by using the target as the cathode
Implementation Method 2
forming a film on a substrate by the plasma in the processing chamber
Implementation Method 3
the target is rotated about a central axis of the target in the plasma generation unit
Data Source
AI summary
A deposition method of arranging a discharge portion of a striker near a target to induce arc discharge and forming a film on a substrate using a plasma generated by the arc discharge is disclosed. The method includes a changing step of changing a position for inducing the arc discharge by the striker in a region set in the target, a deposition step of forming the film on the substrate using the plasma generated by inducing the arc discharge at the position, and a reduction step of reducing the region in accordance with use of the target.