Arc-Shaped Housing Joint Edges for Semiconductor Warpage Control
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Solution Overview
Problem
Semiconductor devices with a base-less structure face challenges in preventing warpage-induced thermal conductivity degradation due to insufficient strength considerations and potential damage from deformation techniques, especially when using ceramic substrates, which affect heat dissipation performance and longevity.
Innovation Solution
A semiconductor device design featuring an insulated circuit board mounted on a housing with arc-shaped joint edges that protrude towards the circuit board, controlling warpage to maintain positive warpage and enhance thermal conductivity, using a baseless structure without a metallic heat-dissipation base, and employing a thermoplastic or thermosetting adhesive to manage stress and prevent cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the insulated circuit board is directly attached to the cooler without a metallic heat-dissipating plate (base-less structure), then the device complexity is reduced and heat dissipation efficiency is improved, but the insulated circuit board is susceptible to warpage and thermal damage during heat cycles
Solution Approach 1:
The patent introduces arc-shaped support ribs with curved surfaces that contact the insulated circuit board. These curved support surfaces prevent warpage by providing distributed support points that accommodate thermal expansion while maintaining structural integrity, resolving the contradiction between simplified base-less structure and thermal stability
Solution Approach 2:
The patent modifies the physical parameters of the housing by incorporating support ribs with specific arc shapes and dimensions. These parameter changes in the housing structure enable it to actively counteract warpage forces on the insulated circuit board during heat cycles, maintaining reliability without adding complex metallic heat-dissipating plates
2Stability of the object's composition
If press molds are used to deform the conducting base-plate to prevent warpage, then warpage control is improved, but the insulated circuit board may be damaged due to its lower strength compared to metallic base plates
Solution Approach 1:
The patent incorporates support ribs into the housing structure during manufacturing, creating a pre-configured anti-warpage mechanism. This preliminary structural design provides continuous support to the insulated circuit board without requiring post-manufacturing deformation or additional strengthening measures, preserving the board's integrity while controlling warpage
Solution Approach 2:
The support ribs act as intermediary elements between the housing and the insulated circuit board. These ribs provide mechanical support and distribute stresses uniformly across the board surface, preventing direct transmission of deformation forces that could damage the weaker ceramic substrate
3Stability of the object's composition
If protrusions are made longer near the center of the heat-dissipating plate to induce positive warpage, then warpage control is improved, but the manufacturing precision required to adjust each protrusion length increases
Solution Approach 1:
The patent uses multiple support ribs with uniform arc-shaped designs distributed across the housing interior. This homogeneous configuration provides balanced support that naturally induces positive warpage without requiring precise individual adjustment of each support element, simplifying manufacturing while maintaining warpage control
Solution Approach 2:
Instead of using a single complex deformable element requiring precise adjustment, the patent segments the support function into multiple identical support ribs. Each rib contributes equally to the overall anti-warpage effect, eliminating the need for high-precision individual adjustment and enabling easier manufacturing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents warpage-induced thermal conductivity degradation, maintains high heat dissipation performance over time, and is suitable for mass production, ensuring stability and longevity of semiconductor devices with ceramic substrates.
Implementation Method 1
an insulated circuit board on which a semiconductor chip is mounted; and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board
Data Source
AI summary
A semiconductor device including an insulated circuit board on which a semiconductor chip is mounted, and a housing implemented by a plurality of side-walls including at least a first pair of facing side-walls, each of the facing side-walls having joint edges configured to be jointed with the insulated circuit board, and each of the joint edges has an arc-shape such that a center in an extending direction of the joint edge protrudes toward the insulated circuit board more than both ends of the extending direction of the joint edge.