Arc-Layout PCB for Motor Power Control

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Solution Overview

Problem

Existing electric motor supply control modules for electronically commutated motors, particularly in three-phase motors, have inefficient layouts that lead to larger printed circuit boards, increased costs, and reduced cooling efficiency due to regular distribution of connection pads and holes around the motor axis.

Innovation Solution

A compact power supply control module design where the connection pads and holes are arranged in an arc of a circle on one side of the printed circuit board, with a main bore aligned with the virtual center, allowing for a more efficient layout that reduces board size, enhances thermal management, and minimizes electromagnetic interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If connection pads and through-holes are regularly distributed around the motor axis, then the layout is symmetric and easy to manufacture, but the printed circuit board size increases and cooling efficiency decreases

Engineering Contradiction:
Improvelayout symmetryVSAvoidprinted circuit board area
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent applies asymmetry by changing the symmetric circular distribution of connection pads and through-holes into an asymmetric arc-shaped distribution concentrated on one side of the printed circuit board. This asymmetric layout reduces the board area while maintaining manufacturability, directly resolving the contradiction between symmetric ease of manufacture and minimized board area.

Inventive Principle:
Principle #4Asymmetry

2Device complexity

If connection pads and through-holes are regularly distributed around the motor axis, then the layout is simple, but thermal cooling efficiency is reduced

Engineering Contradiction:
Improvelayout complexityVSAvoidcooling efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The patent applies dimensionality change by transitioning from a two-dimensional circular distribution pattern to a one-dimensional arc-shaped concentration on one side of the board. This dimensional simplification improves thermal cooling efficiency by creating better airflow paths while actually reducing layout complexity, thus resolving the contradiction between simple layout and cooling efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If connection pads and through-holes are regularly distributed around the motor axis, then the layout follows traditional patterns, but electromagnetic interference increases

Engineering Contradiction:
Improvelayout conventionalityVSAvoidelectromagnetic radiation
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies asymmetry by concentrating connection pads and through-holes in an arc-shaped pattern on one side of the printed circuit board rather than distributing them symmetrically around the motor axis. This asymmetric arrangement reduces electromagnetic radiation by localizing current paths and minimizing loop areas, while still maintaining adaptability to standard motor connector configurations.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentEP3375073B1Module for controlling the power supply of an electric motor
Publication Date: 2021.12.08 VALEO SYST THERMIQUES SAS
  • EP3375073B1 patent drawingFigure 1~2
  • EP3375073B1 patent drawingFigure 3~4

AI summary

The invention relates to a module for controlling the power supply (10) of an electric motor which comprises a printed circuit board (12) bored with a plurality of through-holes (30), respectively associated with an electrical connection pad (32) supported by said plate adjacent to each of said through-holes. The electrical connection pads (32) are arranged on a surface (26) of the printed circuit board (12) so that a virtual circle can be defined passing substantially through each of the connection pads, said pads being concentrated on a portion of the printed circuit board so as to form an arc of circle which is shorter than half the circumference of said virtual circle.