Arc-Mated Sensor Package with Conductive Ring
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Solution Overview
Problem
The challenge in packaging Micro-electro-mechanical systems (MEMS) sensors lies in addressing thermal expansion issues and achieving hermetic sealing while maintaining cost-effectiveness and ease of manufacture, as existing solutions often fail to adequately manage thermal mismatch and sealing effectively.
Innovation Solution
A sensor package design featuring a base with arc-shaped mechanical mating interfaces and a ring that electrically connects the base to an electronics package, utilizing conductive epoxy for vias and adhesive to ensure secure alignment and sealing, with recessed pockets to prevent adhesive overflow and enhance electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensor is hermetically sealed to the packaging, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The sensor is encapsulated within a cavity formed by the base and cover, with the cavity sealed through nested structural elements. The base includes a cavity that houses the sensor, and the cover seals over this cavity, creating a hermetic enclosure without requiring complex external sealing mechanisms.
Solution Approach 2:
A sealing structure acts as an intermediary element between the base and cover, providing hermetic sealing through a simplified interface. The sealing structure includes a sealing surface that mates with the base cavity opening, creating a hermetic seal without requiring complex multi-component assemblies.
2Manufacturing precision
If thermal expansion mismatch is addressed through material selection, then sensor distortion is reduced, but manufacturing cost increases
Solution Approach 1:
The base is designed with a cavity that provides thermal isolation for the sensor, creating a localized thermal environment. The cavity walls act as thermal barriers, protecting the sensor from thermal expansion effects of the main package body without requiring expensive specialized materials throughout the entire structure.
Solution Approach 2:
The package employs composite construction with the base, cover, and sealing structure made from materials selected for their thermal properties. The combination of these materials creates a thermal management system that reduces sensor distortion through differential thermal expansion accommodation without requiring exotic or expensive materials.
3Ease of manufacture
If the package design is simplified for cost-effective manufacturing, then ease of manufacture is improved, but hermetic sealing capability deteriorates
Solution Approach 1:
The package is segmented into discrete components (base, cover, sealing structure) that can be manufactured separately using standard processes and then assembled. The base includes a pre-formed cavity, and the cover is designed to seal over this cavity, allowing each component to be optimized for manufacturing while maintaining hermetic sealing capability through the standardized sealing interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the manufacturing efficiency and cost-effectiveness of MEMS sensor packaging by effectively managing thermal expansion and achieving hermetic sealing, ensuring reliable electrical connections and alignment while minimizing excess adhesive usage.
Implementation Method 1
the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package
Implementation Method 2
recessed pockets for adhesive application, allowing for precise alignment and efficient assembly using conductive epoxy for both electrical and mechanical bonding
Data Source
AI summary
Sensor packages and methods of assembling a sensor in a sensor package are provided. A preferred embodiment comprises: a base including a sensor coupled to the base wherein the base has at least one electrical connection location and a first mechanical mating interface in the shape of an arc; an electronics package with at least one electrical connection location; and a ring coupled between the base and the electronics package wherein the ring electrically connects the at least one electrical connection location on the base and the at least one electrical connection location on the electronics package and wherein the base has a second mechanical mating interface in the shape of an arc that is reciprocal to the first mating interface.