Arc-Shaped Heat Pipe Arrangement for Thermal Dissipation
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Solution Overview
Problem
Conventional heat dissipation devices with finned metal heat sinks are inadequate for efficiently transferring heat away from high-speed electronic components, as they rely solely on metal conduction and struggle to dissipate heat effectively to fins far from the base.
Innovation Solution
A heat dissipation device featuring a heat spreader, a heat sink assembly with four heat sinks, and two heat pipes with arc-shaped condensation sections that connect the spreader to the sink assembly, enhancing heat transfer and dissipation capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a finned metal heat sink is used to dissipate heat from electronic components, then the device structure is simple and manufacturing is easy, but the heat dissipation performance is insufficient for high-speed electronic components generating substantial heat
Solution Approach 1:
The patent applies phase transition by using heat pipes that operate on the phase change of working liquid (evaporation and condensation) to transfer heat from the heat spreader to the heat sink assembly, enabling efficient heat dissipation for high-speed electronic components while maintaining a relatively simple overall structure
Solution Approach 2:
The patent introduces heat pipes as an intermediary component between the heat spreader and heat sink assembly. The heat pipes serve as a mediator to efficiently transfer heat through phase change, bridging the gap between the heat source and the dissipation structure
2Device complexity
If a conventional heat sink transfers heat only by metal conduction, then the structure is simple, but the heat cannot be transferred quickly to the whole heat dissipation device especially to fins far away from the bottom
Solution Approach 1:
The patent uses phase transition in heat pipes (evaporation at the heat spreader end and condensation at the heat sink end) to achieve rapid heat transfer to distant fins, overcoming the limitation of slow conductive heat transfer through metal alone
3Reliability
If heat pipes are added to enhance heat dissipation performance, then the heat transfer capability is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple heat pipes with the heat spreader and heat sink assembly in an integrated configuration, where the heat pipes are thermally coupled to both components. This merging approach enhances heat dissipation capability while maintaining a unified, relatively compact structure rather than adding separate independent systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves improved heat dissipation by evenly distributing heat through the heat sink assembly, increasing efficiency and allowing for better cooling of electronic components, while also simplifying assembly and reducing costs.
Implementation Method 1
Heat pipes, which operate by phase change of working liquid sealed in a hollow pipe
Implementation Method 2
two heat pipes connecting with the heat spreader and the heat sink assembly
Implementation Method 3
a heat spreader for thermally engaging with a heat generating electronic device
Implementation Method 4
The heat absorbed by the heat sink is then dissipated to ambient air
Implementation Method 5
The heat absorbed by the heat sink is then dissipated to ambient air
Data Source
AI summary
A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.