Arc-like Substrate Handling Mechanism for Uniform Treatment
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Solution Overview
Problem
Existing IC manufacturing processes face challenges in efficiently removing smaller particles from microelectronic substrates without damaging sensitive structures, leading to increased costs and yield loss due to the need for larger process chambers and longer cycle times.
Innovation Solution
A substrate handling mechanism that uses simultaneous radial movements, with a pivot component and substrate holder, allowing the substrate to rotate around its center point while moving in an arc-like motion, minimizing the 2-D movement footprint and reducing the size of the process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If linear translation rods with sliding seals are used to move the substrate under spray bars, then the substrate can be treated uniformly, but the chamber volume increases and friction surface areas increase
Solution Approach 1:
Instead of translating the substrate linearly under fixed spray bars, the invention inverts the approach by rotating the spray bars in an arc-like motion to treat different portions of the substrate. This eliminates the need for linear translation rods and sliding seals, reducing chamber volume while maintaining uniform treatment coverage.
Solution Approach 2:
The invention replaces static linear translation with dynamic rotational motion. The spray bars rotate around a pivot point, creating an arc-like motion that dynamically treats different substrate areas. This dynamic approach achieves uniform coverage without requiring the large chamber volume needed for linear translation of large substrates.
2Productivity
If linear translation rods with sliding seals are used to move the substrate, then the substrate can be treated, but particle sources increase due to friction surfaces
Solution Approach 1:
The invention extracts and removes the problematic linear translation rods with sliding seals from the system. By eliminating these components entirely and replacing them with a rotational spray bar mechanism, the source of friction-related particles is removed, improving substrate cleanliness while maintaining treatment capability.
3Ease of operation
If larger chamber volumes are used to accommodate linear translation, then substrate treatment is possible, but process cycle time increases
Solution Approach 1:
The invention inverts the treatment approach by rotating the spray bars to treat the substrate in place, rather than translating the substrate through a large chamber. This reduces the effective treatment path length and allows for shorter process cycle times while achieving complete substrate coverage.
4Manufacturing precision
If spray bars are positioned to treat the entire substrate diameter, then particle removal efficiency is achieved, but the chamber length increases
Solution Approach 1:
The invention uses dynamic rotational motion of the spray bars to achieve comprehensive substrate treatment in a compact space. The arc-like rotation allows the spray bars to cover the entire substrate diameter and treat all areas uniformly without requiring a long chamber length, maintaining particle removal efficiency while reducing footprint.
Data Source
AI summary
Disclosed herein are systems and methods related to a handling system used to move a semiconductor substrate within a process chamber during treatment. The handling system moves the substrate back-and-forth between two locations in an arc-like motion around a pivot point, while simultaneously rotating the substrate around its own center point.