ARM SoC Single-Wire Thermal Interface for Pre-Boot Cooling
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Solution Overview
Problem
ARM-based architecture SoCs in data processing systems lack a single interface for retrieving thermal measurements during the pre-boot stage and are limited by size restrictions, preventing integration with PECI communication channels for active cooling, leading to overheating issues.
Innovation Solution
A modified ARM SoC with a single wire interface allows direct communication with embedded controllers for temperature data exchange, enabling both passive and active cooling without relying on a fully functional OS, using processor throttling and fan control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ARM-based architecture SoCs use traditional interface designs, then device complexity is reduced, but thermal management capability deteriorates due to lack of single interface for thermal measurements during pre-boot stage
Solution Approach 1:
The patent segments the thermal management function by separating thermal sensing (handled by the SoC) from thermal control (handled by the embedded controller), allowing each component to focus on its specific task while communicating through a dedicated single-wire interface
Solution Approach 2:
The patent introduces a single-wire interface as an intermediary communication channel between the SoC and embedded controller, enabling thermal data exchange without requiring complex multi-wire interfaces or OS dependency
2Reliability
If ARM-based architecture SoCs rely on OS-based drivers for cooling, then ease of operation is improved, but reliability deteriorates during pre-boot stage when OS is not functional
Solution Approach 1:
The patent implements preliminary action by enabling thermal management before OS boot completion. The embedded controller can initiate cooling actions (fan activation, processor throttling) directly through the single-wire interface without waiting for OS drivers to load, ensuring thermal protection from pre-boot through normal operation
Solution Approach 2:
The embedded controller performs self-service by independently managing thermal control through the single-wire interface without requiring OS intervention. It can directly read temperature data and execute cooling actions autonomously, eliminating dependency on OS functionality
3Reliability
If SoC housing size is limited, then portability is improved, but active cooling capability deteriorates due to space restrictions preventing fan integration
Solution Approach 1:
The patent implements dynamics by enabling the fan to be activated only when thermal conditions require it, rather than being permanently installed or always active. The embedded controller dynamically controls fan operation based on real-time temperature readings, allowing active cooling capability without permanent housing space commitment
Solution Approach 2:
The patent extracts the thermal control logic from the SoC itself and places it in the embedded controller, allowing the SoC to remain compact while delegating cooling management to a separate, space-efficient controller that can manage fan operation independently
Data Source
AI summary
Methods and systems for managing cooling of a data processing system. In particular, methods and system for providing system temperature control using an embedded controller installed in a data processing system having an advanced reduced instruction set computer machines (ARM) based architecture system on a chip (SoC) are provided. A modified ARM SoC having a single wire interface communication interface may be provided and connected to an embedded controller using a single wire interface. Thermal measurements made by the modified ARM SoC may be provided to the embedded controller across the single wire interface for the embedded controller to provide active and/or passive cooling for the data processing system.