Armature Segment Conductor Bonding Viscosity Control

The patent applies a preliminary action by increasing the viscosity of the binder before the bonding operation. Specifically, the binder's viscosity is increased in advance of applying pressure to bond the conductor segments, preventing the binder from flowing out before the bonding occurs. This preliminary viscosity increase ensures the binder remains at the desired position during the subsequent bonding process.

The patent changes the physical parameter of the binder by increasing its viscosity. The binder is transformed from a low-viscosity pasty state that would flow under pressure to a high-viscosity state that remains in place. This parameter change is achieved through heating or other methods described in the patent, allowing the binder to maintain its position while still enabling effective bonding when pressure is applied.

The patent performs a preliminary action of increasing binder viscosity before the bonding process. By increasing the viscosity in advance, the binder is prepared to resist flow during the subsequent pressure application. This preliminary viscosity increase prevents binder loss during the bonding operation, ensuring sufficient binder remains between the conductor segments to achieve reliable bonding quality.

The patent changes the viscosity parameter of the binder to prevent substance loss. By transforming the binder from a low-viscosity to a high-viscosity state before bonding, the patent prevents the binder from flowing out of the bonding region under pressure. This parameter change ensures that the binder remains where it is needed, maintaining bonding quality while minimizing binder loss.