Aromatic Acrylate Photocurable Composition for Etch-Resistant IAP Layers
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Solution Overview
Problem
There is a need for improved Inkjet Adaptive Planarization (IAP) materials that provide planar photo-cured layers with high etch resistance, mechanical strength, and thermal stability.
Innovation Solution
A photocurable composition comprising at least 90 wt % acrylate monomers with an aromatic group, including bi-functional acrylates like bisphenol A dimethacrylate, and a photoinitiator, with a viscosity of not greater than 15 mPa·s, forming a photo-cured layer with a carbon content of at least 70% and properties such as hardness of at least 0.3 GPa and storage modulus of at least 4.5 GPa.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional photocurable compositions are used, then the composition can be applied easily, but the photo-cured layer has poor etch resistance and mechanical strength
Solution Approach 1:
The patent employs composite materials by combining multiple acrylate monomers with aromatic groups (such as benzyl acrylate, benzyl methacrylate, 1-naphthyl methacrylate, bisphenol A dimethacrylate, divinylbenzene, and 1-naphthyl acrylate) in specific proportions to create a photocurable composition that achieves both high etch resistance and adequate formulation manageability. The composite nature of using multiple functional monomers allows optimization of both reliability and ease of manufacture.
2Stability of the object's composition
If the photocurable composition has high carbon content to improve etch resistance, then thermal stability improves, but viscosity increases making application difficult
Solution Approach 1:
The patent applies parameter changes by carefully controlling the molecular weight, aromatic group content, and proportion of different acrylate monomers to achieve the optimal balance between carbon content (for thermal stability) and viscosity (for ease of application). By adjusting these parameters within specific ranges, the composition achieves at least 70% carbon content while maintaining viscosity of not greater than 15 mPa·s.
Solution Approach 2:
The patent applies local quality by selecting specific acrylate monomers with aromatic groups that provide high carbon content and thermal stability in the cured layer, while ensuring the overall composition maintains low viscosity for easy application. The local presence of aromatic groups in the monomer structure contributes to high carbon content without excessively increasing viscosity.
3Strength
If bi-functional acrylates are used to improve mechanical strength, then the cured layer becomes harder, but the composition complexity increases
Solution Approach 1:
The patent uses composite materials by incorporating bi-functional acrylates (such as bisphenol A dimethacrylate and divinylbenzene) along with other acrylate monomers in a coordinated formulation. This composite approach allows the bi-functional monomers to enhance mechanical strength through crosslinking while the overall composition remains manageable through balanced proportions of different monomer types.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high etch resistance, low shrinkage, and excellent mechanical and thermal stability, suitable for semiconductor processing, with a low viscosity for efficient application.
Implementation Method 1
A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein at least 90 wt % of the polymerizable material comprises acrylate monomers including an aromatic group
Data Source
AI summary
A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein at least 90 wt % of the polymerizable material may comprise acrylate monomers including an aromatic group. The photocurable composition can have a viscosity of not greater than 15 mPa·s, the total carbon content of the photocurable composition after curing can be at least 73%, and the Ohnishi number may be not greater than 3.0.