Aromatic Amide Flow Aid for Liquid Crystalline Polymers

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Solution Overview

Problem

High performance polymers, such as thermotropic liquid crystalline polymers, face challenges in meeting the increased molding demands of intricate part designs without compromising the final product's performance, particularly in terms of flow capacity and dimensional stability.

Innovation Solution

An aromatic amide compound with a specific general formula is developed, which can be used as a flow aid for thermotropic liquid crystalline polymers by altering intermolecular polymer chain interactions, thereby reducing viscosity and minimizing stress-related issues during molding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high performance polymers are used to meet molding demands of intricate part designs, then flow capacity is improved, but dimensional stability deteriorates due to molded-in stress and warpage

Engineering Contradiction:
Improveflow capacityVSAvoiddimensional stability
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The aromatic amide compound acts as an intermediary substance that modifies the polymer matrix properties. It mediates between the conflicting requirements of high flow capacity and dimensional stability by altering intermolecular polymer chain interactions, allowing the polymer to flow better during molding while maintaining dimensional stability in the final part.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the physical and chemical parameters of the polymer system by introducing the aromatic amide compound. This compound modifies the viscosity characteristics and stress relaxation behavior of the polymer matrix, enabling the material to achieve both high flow during injection and low warpage in the molded part.

Inventive Principle:
Principle #35Parameter changes

2Speed

If polymer flow is enhanced to fill complex parts at fast rates, then molding speed is improved, but molded-in stress increases causing warpage

Engineering Contradiction:
Improvemolding speedVSAvoidmolded-in stress
Core Design Contradiction:
SpeedVSStress or pressure

Solution Approach 1:

The aromatic amide compound serves as a mediator that reduces molded-in stress during high-speed molding. It interacts with polymer chains to minimize stress accumulation during rapid filling, thereby reducing warpage while maintaining high molding speeds.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The compound changes the stress relaxation parameters of the polymer matrix, allowing faster molding cycles without proportionally increasing molded-in stress. This enables high-speed production while controlling warpage through modified viscoelastic properties.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If aromatic amide compound is added to reduce viscosity, then flow capacity is improved, but mechanical properties may be adversely affected

Engineering Contradiction:
Improveflow capacityVSAvoidmechanical properties
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The invention optimizes the concentration and molecular structure parameters of the aromatic amide compound to achieve the desired balance. By carefully controlling these parameters, the compound reduces viscosity sufficiently for good flow while maintaining adequate mechanical properties in the final molded part.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The aromatic amide compound effectively lowers the viscosity of the polymer matrix under shear, enhancing the flow and dimensional stability of molded parts without adversely affecting the mechanical properties of the polymer.

Implementation Method 1

altering intermolecular polymer chain interactions, thereby reducing viscosity and minimizing stress-related issues during molding

Methodology Applied
Scientific EffectHydrogen bonding: Chemical Bonding

Data Source

PatentUS8778221B2Aromatic amide compound
Publication Date: 2014.07.15 TICONA LLC
  • US8778221B2 patent drawing
  • US8778221B2 patent drawing
  • US8778221B2 patent drawing

AI summary

An aromatic amide compound having the following general formula (I) is provided:wherein,X1 and X2 are independently C(O)HN or NHC(O);G1, G2 and G3 are independently hydrogen, C(O)HN-phenyl, or NHC(O)-phenyl, wherein at least one of G1, G2 and G3 is C(O)HN-phenyl or NHC(O)-phenyl;Q1, Q2, and Q3 are independently hydrogen, C(O)HN-phenyl, or NHC(O)-phenyl, wherein at least one of Q1, Q2, and Q3 is C(O)HN-phenyl or NHC(O)-phenyl;R5 is halo, haloalkyl, alkyl, alkenyl, aryl, heteroaryl, cycloalkyl, or heterocyclyl; andm is from 0 to 4.