Aromatic Compound Purification for Semiconductor Resist Defect Reduction
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Solution Overview
Problem
The multilayer resist method in semiconductor manufacturing often results in defects during dry etching due to metal impurities, particularly silicon and iron, which can cause pattern transfer errors and reduce yield, as these impurities act as etching masks and lead to abnormalities like cone defects in the semiconductor apparatus.
Innovation Solution
A method involving acid washing and precise filtration of aromatic compounds with aromatic skeletons, such as benzene, fluorene, and naphthalene, to remove metal impurities like silicon and iron, followed by storage in organic resin containers to prevent elution and further contamination, thereby reducing defects during dry etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an organic under layer film is used in the multilayer resist method, then pattern transfer capability is improved, but metal impurities in the organic film act as etching masks causing cone defects and reducing yield
Solution Approach 1:
The patent applies preliminary action by washing the aromatic compound with acid before using it as an underlayer film. This pre-treatment removes metal impurities (silicon and iron) that would otherwise cause cone defects during dry etching, while preserving the film's pattern transfer capability.
Solution Approach 2:
The patent changes the purity parameter of the organic underlayer film by removing metal impurities through acid washing. This parameter change eliminates the harmful etching mask effect of metal particles while maintaining the film's functional properties for pattern transfer.
2Ease of manufacture
If glass containers are used to store composition solutions, then ease of manufacture is improved, but silicon elution from the glass increases metal impurity content causing defects after dry etching
Solution Approach 1:
The patent replaces durable glass containers with disposable organic resin containers. Although organic resin containers may be less durable, they prevent silicon elution and contamination of the composition solution, thereby eliminating the source of metal impurities that cause defects.
Solution Approach 2:
The patent introduces organic resin as an intermediary material between the composition solution and the storage container. This intermediary prevents direct contact between the solution and glass, thereby preventing silicon elution while still providing safe storage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces metal impurities to low levels, minimizing defects after dry etching and enhancing the yield in semiconductor manufacturing processes like liquid immersion exposure and double patterning.
Implementation Method 1
washing a compound having an aromatic skeleton by an acid
Implementation Method 2
filtering the prepared composition solution through a filter
Data Source
AI summary
The present invention provides a method for producing a composition for forming an organic film, the composition being used in a process of manufacturing a semiconductor apparatus, the method including the steps of (1) washing a compound having an aromatic skeleton by an acid, (2) preparing a composition solution containing the washed compound, (3) filtering the prepared composition solution through a filter, and (4) putting the filtered composition solution into a container made of an organic resin. There can be provided a method for producing a composition for forming an organic film that can form an organic film in which defects after dry etching are reduced.