Aromatic Ester Curable Composition for Heat-Resistant Low-Loss Dielectrics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Cured products with low dielectric loss tangents, as described in Patent Literature 1, often lack sufficient heat resistance.
Innovation Solution
A curable composition containing an aromatic ester resin with polymerizable unsaturated bonds and a maleimide compound is used to produce a cured product with enhanced heat resistance and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an active ester compound is used to reduce dielectric loss tangent, then dielectric properties are improved, but heat resistance deteriorates
Solution Approach 1:
The patent combines aromatic ester resin with polymerizable unsaturated bonds and maleimide compound to form a composite curable composition. This composite approach allows the cured product to achieve both low dielectric loss tangent (excellent dielectric properties) and high heat resistance, resolving the contradiction between dielectric performance and thermal stability that plagues conventional active ester-based materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition achieves a balance between excellent heat resistance and dielectric properties, making it suitable for applications in semiconductor package substrates, printed wiring boards, and semiconductor sealing materials.
Implementation Method 1
an aromatic ester resin (A) containing a polymerizable unsaturated bond
Data Source
AI summary
A curable composition to be cured to provide a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film using the curable composition. There is provided a curable composition containing an aromatic ester resin (A) and a maleimide compound (B), the aromatic ester resin (A) being an active ester resin that is a reaction product of a first aromatic compound having two or more phenolic hydroxy groups, a second aromatic compound having a phenolic hydroxy group, and a third aromatic compound having two or more carboxy groups and/or an acid halide thereof or an esterified compound thereof, in which at least one of the first aromatic compound, the second aromatic compound, and the third aromatic compound and/or the acid halide thereof or the esterified compound thereof has a polymerizable unsaturated bond-containing substituent.