Aromatic Ester Curable Composition for Heat-Resistant Low-Loss Resins
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Solution Overview
Problem
Cured products from existing resin compositions with active ester compounds exhibit low dielectric loss tangents but often lack sufficient heat resistance.
Innovation Solution
A curable composition containing an aromatic ester compound with a specific molecular structure and a maleimide compound, which provides a cured product with enhanced heat resistance and dielectric properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If an active ester compound is used to reduce dielectric loss tangent, then dielectric properties are improved, but heat resistance becomes insufficient
Solution Approach 1:
The patent combines an aromatic ester compound (A) with a maleimide compound (B) to create a composite curable composition. This composite approach allows the material to simultaneously achieve low dielectric loss tangent (improved dielectric properties) and high heat resistance, resolving the technical contradiction between these two properties that cannot be achieved with a single compound type.
Solution Approach 2:
The patent specifies precise compositional parameters: the aromatic ester compound (A) contains specific structural features (Ar1 as substituted or unsubstituted aromatic ring group, specific R1 and R2 groups, and controlled m and n values), and the maleimide compound (B) is used in specific proportions. By controlling these chemical parameters and composition ratios, the cured product achieves both low dielectric loss tangent and high heat resistance.
2Loss of energy
If a resin composition is designed for low dielectric loss tangent, then dielectric properties are improved, but heat resistance deteriorates
Solution Approach 1:
The patent creates a composite curable composition combining aromatic ester compound (A) and maleimide compound (B). This composite material system enables simultaneous achievement of low dielectric loss tangent and high heat resistance, resolving the contradiction between dielectric properties and heat resistance reliability that plagues conventional single-component resin compositions.
Solution Approach 2:
The patent defines specific compositional parameters including the structural characteristics of aromatic ester compound (A) with controlled substitution patterns and the inclusion of maleimide compound (B) in specific amounts. These parameter controls ensure the cured product achieves both low dielectric loss tangent and high heat resistance, improving reliability for electronic applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable composition achieves a balance between high heat resistance and low dielectric loss tangent, making it suitable for electronic materials like semiconductor package substrates and printed wiring boards.
Implementation Method 1
a curable composition containing an aromatic ester compound (A) and a maleimide compound (B)... to be cured to provide a cured product
Data Source
AI summary
A curable composition to be cured to a cured product excellent in heat resistance and dielectric properties, a cured product of the curable composition, a printed wiring board, a semiconductor sealing material, and a build-up film. There is a curable composition containing an aromatic ester compound (A) and a maleimide compound (B), the aromatic ester compound (A) being represented by structural formula (1) (where in the formula, Ar1 is a substituted or unsubstituted aromatic ring group, each R1 is a polymerizable unsaturated bond-containing substituent, each 1 is 0 or 1, each R2 is any of an alkyl group, an alkoxy group, an alkyloxycarbonyl group, an alkylcarbonyloxy group, and a halogen atom, each m is 0 or an integer of 1 to 5, and n is 2 or 3, provided that at least one polymerizable unsaturated bond-containing substituent is contained in one molecule as a substituent on Ar1 or as R1).