Aromatic Polyimide Release Layer for Flexible Substrate Separation
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Solution Overview
Problem
The challenge in manufacturing flexible electronic devices is to develop a substrate structure that can withstand high temperatures without the flexible layer adhering to the glass substrate, which is critical for preventing peeling issues during device processing.
Innovation Solution
A substrate structure comprising a supporting layer, a release layer made of aromatic polyimide, and a flexible layer, where the adhesion between the flexible and supporting layers is stronger than between the release and supporting layers, allowing for easy separation of the release layer and enhancing process yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a flexible layer is placed on a glass substrate for high-temperature processing, then the device can withstand high temperatures, but the flexible layer adheres to the glass substrate causing peeling issues
Solution Approach 1:
A release layer is introduced as an intermediary between the flexible layer and the glass substrate. This release layer has controlled adhesion properties that prevent the flexible layer from adhering to the glass substrate during high-temperature processing, thereby solving the adhesion stability issue while maintaining temperature resistance
Solution Approach 2:
The substrate structure is segmented into three distinct layers: the glass substrate, the release layer, and the flexible layer. This segmentation allows each layer to perform its specific function independently, with the release layer acting as a buffer that manages the adhesion interface between the rigid substrate and the flexible component
2Device complexity
If the flexible layer is directly attached to the glass substrate, then the structure is simpler, but separation after processing becomes difficult
Solution Approach 1:
The release layer serves as a mediator that facilitates easy separation after processing. Its specific adhesion characteristics allow it to hold the flexible layer during manufacturing but release it cleanly when separation is needed, improving ease of manufacture without significantly complicating the overall structure
3Reliability
If high-temperature resistant materials are used to prevent peeling, then adhesion stability improves, but the material selection and process complexity increase
Solution Approach 1:
Rather than requiring the flexible layer itself to be high-temperature resistant with special adhesion properties, the release layer is used as a mediator that provides the necessary thermal stability and adhesion control. This approach improves peel resistance while keeping material selection and process complexity manageable
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The substrate structure effectively prevents the flexible layer from sticking to the glass substrate during high-temperature processes, enabling efficient separation and reducing peeling issues, thus improving the process yield and product reliability.
Implementation Method 1
the release layer is an aromatic polyimide
Data Source
AI summary
Disclosed is a substrate structure for manufacturing a flexible electronic device, including a supporting layer, a release layer covering the supporting layer with a first area, wherein the release layer is an aromatic polyimide, and a flexible layer covering the supporting layer and the release layer with a second area. The second area is greater than the first area. The adhesion force between the flexible layer and the supporting layer is stronger than the adhesion force between the release layer and the supporting layer.