Array Base Plate Depression Structure for Chip Binding Corrosion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current liquid-crystal displaying devices face issues with the alignment film spreading to the chip binding region due to the EM value being greater than the distance between the chip binding region and the displaying region, leading to corrosion and screen blacking when the boundary frame is narrowed.
Innovation Solution
An array base plate with a target film layer having a depression structure at the chip binding region, which reduces the EM value of the alignment film, preventing it from coinciding with the chip binding region and thus avoiding contact during chip binding, thereby preventing corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the boundary frame width is reduced to increase screen-to-body ratio, then the display area is improved, but the alignment film spreads to the chip binding region causing corrosion
Solution Approach 1:
The patent applies local quality by creating a depression structure specifically at the position corresponding to the chip binding region in the target film layer. This local structural modification ensures that the alignment film does not spread to the chip binding region, while the rest of the display area maintains normal alignment film coverage. The depression structure is formed with specific dimensions (depth of 0.2-0.5mm, length extending beyond the chip binding region) to locally prevent alignment film intrusion without affecting overall display performance.
2Length of stationary object
If the distance between chip binding region and displaying region is reduced to narrow boundary frame, then the device compactness is improved, but the alignment film EM value exceeds the distance causing spread-coating
Solution Approach 1:
The patent applies preliminary action by forming the depression structure in the target film layer before the alignment film is applied. This pre-formed depression structure acts as a physical barrier that prevents the alignment film from spreading to the chip binding region, even when the EM value is high due to reduced boundary frame width. The depression structure is created during the target film layer formation process, ensuring proper alignment and positioning before subsequent manufacturing steps.
3Reliability
If the alignment film EM value is increased to improve alignment performance, then the alignment effect is improved, but the alignment film spreads to the chip binding region causing corrosion
Solution Approach 1:
The patent applies segmentation by dividing the target film layer into different functional regions: a first region corresponding to the displaying region where the alignment film can normally contact and align, and a second region corresponding to the chip binding region where the depression structure prevents alignment film contact. This segmentation allows the alignment film to have high EM value for good alignment performance in the display area while being physically blocked from the chip binding region, thus preventing corrosion.
Data Source
AI summary
An array base plate and a fabricating method thereof, a display panel and a displaying device. The array base plate includes a substrate, the substrate is divided into a displaying region and a non-displaying region that surrounds the displaying region, and the non-displaying region includes a chip binding region; the array base plate further includes a target film layer provided on the substrate, and the target film layer extends to the non-displaying region; and the target film layer has a depression structure on a side that faces the chip binding region, and a position of the depression structure corresponds to a position of the chip binding region, whereby an orthographic projection of an alignment film in the array base plate on the substrate does not have a coinciding area with the chip binding region.