Array Substrate Circuit Repair Line for Laser Via Deviation

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Solution Overview

Problem

The quality of circuits on array substrates deteriorates during repair due to issues like laser punching deviations and via holes that are larger than the circuit, affecting display panel quality in high-definition displays.

Innovation Solution

A method involving determining a section to be repaired, forming a conductive repair line between the section ends, and covering it with an insulating material to ensure signal transmission, using laser punching and deposition techniques to correct deviations and form accurate via holes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If laser punching is used to create via holes for circuit repair, then the circuit can be repaired and signal transmission restored, but laser punching deviations occur that affect repair precision and substrate quality

Engineering Contradiction:

Improvecircuit repair reliabilityVSAvoidlaser punching precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies a conductive material to form a repair line that extends beyond the via holes at both ends of the abnormal section. This preliminary extension ensures that even if laser punching deviates, the conductive material provides sufficient overlap to maintain electrical connection, thus resolving the contradiction between repair reliability and punching precision.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the parameter of conductive material coverage by extending the repair line beyond the via holes. This parameter change creates a buffer zone that compensates for laser punching deviations, allowing reliable circuit repair without requiring extremely precise laser punching.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If via holes are made larger to ensure proper connection during repair, then connection reliability improves, but the via holes become bigger than the circuit which deteriorates substrate quality

Engineering Contradiction:

Improveconnection reliabilityVSAvoidvia hole size control

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies conductive material to form a repair line that protrudes beyond the via holes. This preliminary extension ensures that the conductive material provides sufficient connection area even when via holes are larger than the circuit, maintaining connection reliability without requiring precise via hole sizing.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent segments the conductive material application into distinct regions: the via holes for electrical connection and the extended repair line for providing connection buffer. This segmentation allows via holes to be larger for reliability while the extended material compensates for the size mismatch.

Inventive Principle:

Principle #1Segmentation

3Productivity

If the circuit is repaired using conventional LCVD technology, then production yield can be improved, but the repair process causes deviation and via hole size issues that affect display quality

Engineering Contradiction:

Improveproduction yieldVSAvoidrepair precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies conductive material to form a repair line that extends beyond the via holes before final inspection. This preliminary extension ensures that even with conventional LCVD technology's inherent deviations, the circuit remains functional, thus improving production yield without requiring ultra-precise repair processes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent changes the coverage parameter of the conductive material to extend beyond the via holes. This parameter change creates a tolerance buffer that accommodates deviations from conventional LCVD technology, enabling higher production yield without sacrificing display quality.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method improves the production yield of array substrates by ensuring normal signal transmission and enhancing the reliability of the repaired circuits.

Implementation Method 1

performing a laser punching operation at two ends of the section to be repaired, to form a via hole to expose the signal line

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

depositing the conductive material in the via hole to form conductive terminals; and depositing the conductive material between the conductive terminals to form the repair line

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 3

coating the insulating material on the repair line; and heating and curing the insulating material to form the cover layer

Methodology Applied

Scientific EffectCuring:

Data Source

PatentUS12538772B2Method and device for repairing circuit on array substrate, and array substrate

Publication Date: 2026.01.27 CHUZHOU HKC OPTOELECTRONICS TECH CO LTD

AI summary

Disclosed are a method and a device for repairing a circuit on an array substrate, and an array substrate. The method includes: determining a section to be repaired on each signal line; applying a conductive material to form a repair line between two ends of the section to be repaired, the repair line being connected with two ends of the section to be repaired; and applying an insulating material to form a cover layer above the repair line, the cover layer completely covers the surface of the repair line.