Array Connection Structure With Airflow Cooling and Direct Signal Paths
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Solution Overview
Problem
The heat dissipation effect is poor and signal loss is significant due to the use of a back plate for connecting electronic components in servers, which blocks airflow and requires indirect connections.
Innovation Solution
An array type connection structure with a support and connecting assemblies that allow direct electrical connections and incorporate heat dissipation through holes, enabling airflow to circulate between components and minimize signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a back plate is used to connect the chip set and hard disk, then the arrangement is regularized and connections are established, but the heat dissipation airflow is blocked and heat dissipation effect is reduced
Solution Approach 1:
The patent extracts and removes the back plate from the system entirely. Instead of using a back plate for connection, the invention uses a support structure with connecting assemblies that penetrate through the support, eliminating the blocking element while maintaining connection functionality. This allows airflow to pass through without obstruction.
Solution Approach 2:
The support structure serves multiple functions: it provides mechanical support for regularized arrangement of components, enables electrical connections through penetrating connecting assemblies, and simultaneously allows heat dissipation through its open structure. This multi-functionality replaces the back plate's connection function without compromising heat dissipation.
2Reliability
If a back plate is used to connect the chip set and hard disk, then connections are established, but signal loss is caused due to indirect connection
Solution Approach 1:
The back plate is completely removed from the system. The invention replaces it with connecting assemblies that create direct electrical pathways between components, eliminating the indirect connection through a back plate and reducing signal loss in the process.
Solution Approach 2:
The connecting assemblies serve as direct intermediaries between components, providing optimal electrical connection pathways. Unlike a back plate that requires signals to travel through additional traces and connections, the penetrating connecting assemblies establish direct electrical contact, minimizing signal degradation.
3Strength
If a back plate is disposed between the chip set and hard disk, then structural support is provided, but airflow circulation is blocked and heat dissipation is reduced
Solution Approach 1:
The back plate is removed entirely and replaced with a support structure that does not block airflow. The new design uses penetrating connecting assemblies that maintain structural support while allowing air to circulate freely through the open spaces in the support structure.
Solution Approach 2:
The support structure is designed with an open, porous-like configuration that provides mechanical support while allowing airflow to pass through. The structure has sufficient openness to permit air circulation for heat dissipation while maintaining the necessary structural integrity to support components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures effective heat dissipation and reduces signal loss by allowing direct connections and unobstructed airflow, improving the overall performance of the connection structure.
Implementation Method 1
the heat dissipation through hole can be used as a flow channel of airflow, allowing the airflow to flow between the first side and the second side of the support via the heat dissipation through hole, thereby taking away heat generated when the first electronic component and the second electronic component operate
Data Source
AI summary
An array type connection structure includes a support and connecting assemblies. There is no signal cable routing in the support. Each connecting assembly penetrates through the support; a first side of each connecting assembly has a connector interface including a plurality of first signal terminals, and the connector interface is configured to be connected to a first electronic component located on a first side of the support. A second side of each connecting assembly is directly connected to a plurality of cables, the plurality of cables are in a one-to-one correspondence with the plurality of second signal terminals of the connecting assembly, and the cable is configured to be connected to a second electronic component located on a second side of the support. The support is provided with a heat dissipation through hole, which is at least partially located between two adjacent connecting assemblies.