Electronic Array Connection Layer for ECM and PD Mitigation

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Solution Overview

Problem

Existing electronic arrays face challenges with electro-chemical migration (ECM) and partial discharge (PD) effects due to the use of conductive glues and isolation materials, which can lead to short circuits and reduced product lifetime.

Innovation Solution

An electronic array design featuring a first and second electronic component with different operation voltages, separated by an isolation layer and connected via a connection layer with both electrically isolating and conductive materials, which fixes and couples the isolation layer to the components, reducing ECM and PD risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive glue is used to provide electrical connection, then electrical coupling is achieved, but electro-chemical migration effects occur leading to short circuits

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidelectro-chemical migration

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The connection layer is divided into two distinct portions: a electrically isolating material portion and an electrically conductive material portion. This segmentation allows the isolating portion to prevent ECM effects while the conductive portion provides necessary electrical coupling, resolving the contradiction between connection reliability and ECM resistance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The connection layer uses a composite structure combining electrically isolating material and electrically conductive material in specific portions. This composite approach enables simultaneous achievement of electrical isolation (preventing ECM) and electrical conduction (providing connection), thus resolving the technical contradiction.

Inventive Principle:

Principle #40Composite materials

2Object-affected harmful factors

If non-conductive glue is used to avoid ECM effects, then isolation properties improve, but break-through-voltage decreases leading to partial discharge

Engineering Contradiction:

ImproveECM resistanceVSAvoidbreak-through-voltage

Core Design Contradiction:

Object-affected harmful factorsVSReliability

Solution Approach 1:

Different portions of the connection layer have different electrical properties: the first portion uses electrically isolating material for ECM resistance while the second portion uses electrically conductive material for adequate break-through-voltage. This local differentiation resolves the contradiction between ECM resistance and break-through-voltage.

Inventive Principle:

Principle #3Local quality

3Strength

If isolation layer is fixed using conductive glue, then mechanical fixation is achieved, but ECM effects occur at the glue interface

Engineering Contradiction:

Improvemechanical fixationVSAvoidECM at interface

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The connection layer is segmented into isolating and conductive portions, where the isolating material portion provides both mechanical fixation and ECM resistance at the interface, while the conductive portion provides electrical coupling without exposing conductive materials to the isolation layer interface.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design significantly minimizes ECM and PD effects, leading to enhanced isolation properties and extended product lifetime by using a combination of isolating and conductive materials in the connection layer.

Implementation Method 1

the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS9111772B1Electronic array and chip package

Publication Date: 2015.08.18 INFINEON TECHNOLOGIES AG

AI summary

An electronic array may include a first electronic component which has a first operation voltage, a second electronic component which has a second operation voltage, wherein the second operation voltage is different from the first operation voltage and wherein the first electronic component and the second electronic component are arranged over each other, an isolation layer between the first electronic component and the second electronic component, wherein the isolation layer electrically isolates the first electronic component from the second electronic component, at least one connection layer formed at least partially between the isolation layer and the first electronic component or between the isolation layer and the second electronic component, wherein the connection layer includes a first portion and a second portion, wherein the first portion and the second portion each extend from the corresponding electronic component to the isolation layer, wherein the first portion includes an electrically isolating material which fixes the isolation layer to the corresponding electronic component and wherein the second portion includes an electrically conductive material which electrically couples the corresponding electronic component to the isolation layer.