Digital Printing Mold With Array Electrode For Pattern Versatility
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Solution Overview
Problem
Conventional printing techniques require the manufacture of multiple molds for different patterns, leading to high costs and inefficiencies, as they are not adaptable to small-volume, large-variety production and are prone to damage from high temperatures and frequent ink refilling.
Innovation Solution
The development of a digital printing mold featuring an array-type electrode structure with a substrate, isolating layer, electrode parts, and micro-structure layer, where the electrode parts are connected through a substrate hole, allowing for precise ink movement without high voltage, reducing mold production needs and energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional printing techniques (screen printing, gravure printing, flexo printing) are used to print different patterns, then multiple printing molds must be manufactured, but this leads to high production costs and inefficiencies
Solution Approach 1:
The patent implements a single printing mold with multiple electrode arrays that can print different patterns by controlling electrode activation sequences. The mold includes first, second, third, and fourth electrode arrays arranged in specific configurations, allowing versatile pattern printing without requiring multiple specialized molds, thereby reducing production costs and increasing adaptability
Solution Approach 2:
The printing mold is divided into multiple independent electrode arrays (first, second, third, fourth arrays) that can be independently controlled. Each electrode array consists of multiple electrodes that can be selectively activated to create different printing patterns, enabling a single mold to perform multiple functions through segmented control
2Ease of operation
If high voltage is applied to move ink droplets in conventional array-type electrodes, then ink movement can be achieved, but the system consumes high energy and generates heat that can damage the mold
Solution Approach 1:
The patent changes the electrical parameters by applying low voltage to a larger number of electrodes simultaneously rather than high voltage to fewer electrodes. This parameter transformation reduces energy consumption and heat generation while maintaining effective ink droplet movement control through coordinated activation of multiple electrode arrays
3Productivity
If conventional printing molds are used for small-volume, large-variety production, then manufacturing flexibility is needed, but conventional molds are not adaptable and require frequent replacement
Solution Approach 1:
The printing mold employs dynamic control of electrode activation where different combinations of electrodes within the first, second, third, and fourth arrays can be activated to create various printing patterns. This dynamic switching capability allows the single mold to adapt to small-volume, large-variety production requirements without physical replacement, significantly improving both productivity and adaptability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the digital printing mold to change patterns without multiple molds, achieving higher resolution, reducing production costs, improving efficiency, and preventing damage from high temperatures, thus aligning with the market trend of small-volume, large-variety production.
Implementation Method 1
executing an electroplating process to form a connection part in the through hole to connect the driving electrode part to the conductive part
Data Source
AI summary
An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.