Multi-element Array Footprint Layout for Compact Termination
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Solution Overview
Problem
There is a need for electronic components with increased functionality and capacitance value in a smaller footprint to efficiently occupy less space on a circuit board, while also providing adequate termination structures for connection to external circuitry.
Innovation Solution
A multi-element array with a rectangular configuration and a footprint layout that includes a plurality of stacked dielectric-electrode layers, where each element electrode has a lead for termination to one side surface, allowing for efficient application and location of termination structures, and a varistor array providing differential mode and common mode transient voltage surge protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple elements are stacked in a multilayer ceramic device to increase functionality, then the number of elements increases, but the device complexity and termination structure requirements increase
Solution Approach 1:
Multiple element electrodes are combined into a single common termination structure on the side surface, allowing multiple elements to share a common electrical connection point and reducing the number of separate termination structures needed
Solution Approach 2:
The common termination structure serves multiple functions by providing a shared electrical connection for multiple element electrodes, thereby reducing overall device complexity while maintaining multiple functional elements
2Quantity of substance
If element electrodes are terminated to end surfaces, then termination is achieved, but the footprint area increases
Solution Approach 1:
The termination location is moved from the end surfaces to the side surfaces of the device, utilizing a different spatial dimension for termination structures and thereby reducing the footprint area required on the circuit board
3Area of stationary object
If more elements are packed in a smaller size, then the footprint is reduced, but the termination structure application becomes more difficult
Solution Approach 1:
Multiple element electrodes are merged into a common termination structure that can be applied to the side surface in a single operation, making termination structure application easier despite high element density
Solution Approach 2:
The termination structures are concentrated on the side surfaces rather than distributed across end surfaces, creating localized termination zones that are easier to manufacture and apply
Data Source
AI summary
An element array and a footprint layout for an element array are disclosed. The element array can have a rectangular configuration defining two side surfaces and two end surfaces. The element array can include a plurality of stacked dielectric-electrode layers. One dielectric-electrode layer can include a plurality of element electrodes, such as eight element electrodes. Each of the plurality of element electrodes forms a part of an individual element for the element array. The element array device can further include a common electrode. The common electrode is used as part of each of the individual elements for the element array. The common electrode can include a lead for termination to one of the two end surfaces of the element array or, in a particular embodiment, to one of the two side surfaces of the element array.