Structural-Element Array Image Reconstruction for Drift and Charging
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Solution Overview
Problem
Semiconductor specimens are subjected to image distortion during monitoring due to mechanical drift and charging, necessitating effective image reconstruction methods.
Innovation Solution
A system and method involving a processor and memory circuitry for image reconstruction, utilizing charged particle beams, includes steps like decimation, sub-pixel resolution location determination, distortion compensation transforms, and spline kernel application to correct image distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If charged particle devices scan the specimen with an electron beam to acquire images, then image acquisition is enabled, but image distortion occurs due to mechanical drift and charging
Solution Approach 1:
The patent applies preliminary action by acquiring reference images at multiple stages before the final measurement. Specifically, reference images are captured at the beginning and end of the scanning process, allowing the system to pre-characterize distortion patterns and compensate for them during actual measurement, thereby maintaining measurement precision while accounting for mechanical drift and charging effects
Solution Approach 2:
The patent implements feedback through a systematic process where reference images are used to generate distortion maps, which then inform the creation of correction transforms. These transforms are applied to subsequent measurement images, and the process iterates with new reference images, creating a closed-loop feedback system that continuously refines distortion compensation and maintains image accuracy
2Measurement precision
If image reconstruction methods are applied to correct distortions, then image accuracy is improved, but processing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the image reconstruction process into distinct modular stages: acquiring reference images, computing distortion maps, generating correction transforms, and applying corrections to measurement images. Each stage is independent and can be processed separately, reducing overall processing complexity while maintaining the precision benefits of comprehensive distortion correction
Solution Approach 2:
The patent utilizes parameter changes by transforming images through mathematical operations that adjust spatial coordinates and pixel values based on distortion characteristics. By representing distortions as transform parameters that can be systematically varied and optimized, the system achieves accurate reconstruction without requiring complex real-time computation during actual measurement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reconstructs distorted semiconductor images, enhancing the accuracy and reliability of specimen examination.
Implementation Method 1
acquiring images by charged particle devices that scan the specimen with an electron beam
Data Source
AI summary
There is provided a method and a system configured to compensate for image distortions. An example method includes first receiving a warped image of an array of cells of a specimen. Each cell of the array comprises one or more structural elements of a substrate. A reference image of a region associated with a cell of the array of cells is generated and a first cell of the array of cells is identified using the reference image and at least part of the warped image. One or more locations comprising cells that differ from the first cell are identified and, based at least on the one or more locations, a warped compensation transform is determined. The warped compensation transform is applied on the warped image to generate an undistorted image.