Array Imaging Layout for Micron-Scale Full-Surface Detection

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Solution Overview

Problem

Existing image detection methods struggle to achieve high-resolution, close-range, and full-surface detection of micron-level image features, particularly in the manufacturing process of lithium batteries, due to limitations in equipment size, scanning distance, and imaging resolution.

Innovation Solution

An array-type image detection device is designed with two rows of imaging arrays arranged at intervals, each comprising multiple imaging modules with magnifying lenses and imaging chips. The device achieves magnified imaging and overlapping detection areas to ensure comprehensive coverage without blind spots.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If conventional image detection methods are used, then equipment size and scanning distance are reduced, but imaging resolution and detection precision deteriorate

Engineering Contradiction:
Improveequipment sizeVSAvoidimaging resolution
Core Design Contradiction:
Length of stationary objectVSMeasurement precision

Solution Approach 1:

The detection device is divided into multiple imaging modules arranged in arrays, with each module containing a magnifying lens and imaging chip. This segmentation allows the system to achieve high-resolution detection through multiple discrete imaging units rather than requiring a single large-scale detection system, thus reducing overall equipment size while maintaining high imaging resolution.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from conventional single-point or line detection to two-dimensional array detection by arranging imaging modules in row and column configurations. This dimensional change enables simultaneous full-surface detection with high resolution without increasing scanning distance or equipment size proportionally.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If magnifying lenses with large aperture are used, then imaging resolution is improved, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveimaging resolutionVSAvoidmanufacturing difficulty
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Instead of using a single large-aperture magnifying lens, the system employs multiple imaging modules with smaller aperture lenses arranged in arrays. Each module has optimized local optical quality suitable for its specific detection zone, collectively achieving high-resolution full-surface detection while simplifying individual component manufacturing.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

Multiple imaging modules with smaller lenses are combined in array configurations to achieve the cumulative detection capability equivalent to or exceeding that of a single large-aperture lens. This merging approach reduces manufacturing complexity of individual components while maintaining or improving overall imaging resolution.

Inventive Principle:
Principle #5Merging (Combining)

3Device complexity

If single-row imaging arrays are used, then device complexity is reduced, but detection coverage and reliability deteriorate due to blind spots

Engineering Contradiction:
Improvearray configurationVSAvoiddetection coverage
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The detection system is segmented into multiple imaging modules arranged in two or more rows, with each row covering a specific detection zone. This segmentation eliminates blind spots by ensuring complete spatial coverage through the distributed arrangement of imaging modules across different rows.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system transitions from single-row to multi-row array configuration, adding a dimensional aspect to the detection coverage. This multi-dimensional arrangement ensures that all areas of the detection surface are covered by at least one imaging module, eliminating blind spots and improving detection reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Reliability

If overlapping detection areas are implemented, then detection reliability is improved, but device complexity and data processing requirements increase

Engineering Contradiction:
Improvedetection reliabilityVSAvoiddata processing
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The imaging modules are pre-configured with overlapping detection areas during system design and installation. This preliminary arrangement ensures that every region of interest is captured by multiple modules, providing redundant detection data before actual measurement begins, thereby improving reliability without requiring complex real-time processing decisions.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The device enables high-resolution, close-range, and full-surface image detection of micron-level features, effectively addressing the limitations of existing technologies and ensuring accurate detection of critical image features in lithium battery manufacturing.

Implementation Method 1

each imaging module includes a magnifying lens and an imaging chip arranged in sequence along an optical axis of each imaging module; an image to be detected in a detection area of each imaging module is imaged by each imaging module in a magnified form in an imaging area of each imaging module

Methodology Applied
Scientific EffectLight refraction: Refraction

Data Source

PatentUS20250089392A1Array-type image detection device
Publication Date: 2025.03.13 WEIHAI HUALING OPTO ELECTRONICS CO LTD
  • US20250089392A1 patent drawing
  • US20250089392A1 patent drawing
  • US20250089392A1 patent drawing

AI summary

Am array-type image detection device including two rows of imaging arrays arranged at intervals along a first direction, each row of the imaging array includes a plurality of imaging modules arranged at intervals along a second direction, each imaging module includes a magnifying lens and an imaging chip arranged in sequence along its optical axis; the image to be detected in a detection area of each imaging module is imaged in an imaging area of each imaging module in a magnified way by each imaging module and is acquired by the imaging chip in the imaging area of each imaging module; and except for the detection areas at the front and back sides in the second direction, each detection area has overlapping portions with other detection areas at two ends along the second direction.