Array Substrate Pad Layout for IC Bump Misalignment Compensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Flexible array substrates used in display devices, such as LCDs and OLEDs, experience size changes during manufacturing, leading to misalignment between the bumps of a driving integrated circuit and the pads of a pad unit, causing mounting issues.
Innovation Solution
The array substrate is designed with a pad portion featuring pads formed as parallelograms with specific inclination angles, allowing for flexible alignment and movement of the integrated circuit to correct misalignment due to substrate expansion or contraction, using anisotropic conductive films for electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible array substrate is used to enable flexible display manufacturing, then adaptability and flexibility are improved, but manufacturing precision deteriorates due to size changes causing misalignment between bumps and pads
Solution Approach 1:
The pad structure is designed to be movable relative to the display area, allowing the pad unit to dynamically adjust its position to compensate for substrate size changes. The pad unit can move in the first direction (lengthwise direction of the substrate) to maintain alignment between pads and bumps despite substrate expansion or contraction.
Solution Approach 2:
The invention changes the spatial parameter (position) of the pad unit dynamically. By allowing the pad unit to change its position along the first direction, the system compensates for size variations in the flexible substrate, maintaining alignment precision despite changes in substrate dimensions.
2Ease of manufacture
If the substrate size changes during manufacturing processes, then flexibility in manufacturing is improved, but alignment precision deteriorates causing misalignment between bumps and pads
Solution Approach 1:
The pad unit is designed with movable characteristics, enabling it to adjust its position after substrate size changes occur during manufacturing. This dynamic adjustment capability allows the system to maintain alignment precision even when the substrate expands or contracts during the manufacturing process.
Solution Approach 2:
The invention establishes a movable pad structure in advance that is prepared to compensate for size changes. The pad unit is positioned and configured beforehand to allow for subsequent adjustments, ensuring that alignment can be maintained despite manufacturing process variations.
3Reliability
If pads are fixed in position to ensure stable electrical connection, then reliability is improved, but adaptability deteriorates when substrate size changes cause misalignment
Solution Approach 1:
The pad unit transitions from a fixed to a movable configuration, allowing it to dynamically adjust its position to maintain electrical connection reliability. The movable design enables the pad unit to follow the displacement caused by substrate size changes, ensuring continuous reliable electrical connection between bumps and pads.
Solution Approach 2:
The invention introduces movement along the first direction (lengthwise direction of the substrate) as an additional degree of freedom for the pad unit. This dimensional adjustment capability allows the pad unit to compensate for misalignment while maintaining stable electrical connection.
Data Source
AI summary
An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.