Array PCB Replacement via Rail and Tab Routes

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Solution Overview

Problem

The existing methods for manufacturing electronic apparatuses using array printed circuit boards (PCBs) are inefficient due to the need to discard entire arrays when one or more single PCBs are defective, leading to reduced productivity and time-consuming testing processes after repairing the array PCBs.

Innovation Solution

An array PCB design featuring a rail portion and tab route portions with via electrodes allows for easy replacement of defective single PCBs, enabling testing without separating individual PCBs, and a method for manufacturing electronic apparatuses using this design, which includes forming solder layers to connect the PCBs and attaching electronic devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If a defective single PCB is removed and replaced in an array PCB, then the array PCB can be reused, but testing each single PCB after separation is time-consuming and reduces productivity

Engineering Contradiction:
Improvereplacement of defective single PCBVSAvoidtesting efficiency
Core Design Contradiction:
Ease of repairVSProductivity

Solution Approach 1:

The patent implements a test terminal portion that allows testing of single PCBs before they are separated from the array PCB. By performing tests in advance while the PCBs are still connected to the array structure with rail portions and tab route portions, the need for time-consuming post-separation testing is eliminated, thus improving productivity while maintaining ease of repair

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces test terminals as intermediary access points that enable testing without requiring separation of individual PCBs from the array. These terminals provide a mediator interface between the test equipment and the single PCBs, allowing non-destructive testing while maintaining the integrity of the array structure

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the entire array PCB is discarded when one or more single PCBs are defective, then quality control is maintained, but productivity is reduced due to waste

Engineering Contradiction:
Improvequality controlVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent divides the array PCB into separable single PCB units connected through rail portions and tab route portions. This segmentation allows individual defective PCBs to be identified and replaced without affecting the entire array, enabling quality control at the component level while maintaining high manufacturing efficiency through selective replacement rather than total discarding

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent enables recovery and reuse of non-defective single PCBs from arrays containing defective units. By implementing easy replacement mechanisms with standardized connections, the system allows defective PCBs to be discarded while recovering and reusing the functional ones, thus maintaining quality standards while improving productivity through resource optimization

Inventive Principle:
Principle #34Discarding and recovering

Data Source

PatentUS9451691B2Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
Publication Date: 2016.09.20 SAMSUNG ELECTRONICS CO LTD
  • US9451691B2 patent drawing
  • US9451691B2 patent drawing
  • US9451691B2 patent drawing

AI summary

An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.