Array Base Plate Layout for Back Detection of LED Cold Joints
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Solution Overview
Problem
The issue of cold joints during the soldering of Mini LED and Micro LED chips leads to imperfect conduction between the LED chips and the substrate, resulting in deteriorated display quality and significant cost losses due to undetected defects.
Innovation Solution
An array base plate with a substrate featuring light transmitting areas and a conductive layer, where at least half of the conductive pad surface is visible through these areas, allowing for accurate detection of soldering imperfections using back detection techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is made opaque or with low light transmittance to improve structural strength and electrical insulation, then the mechanical strength and electrical insulation are improved, but the ability to detect soldering imperfections through back detection techniques is deteriorated
Solution Approach 1:
The substrate is designed with differentiated local properties: light transmitting areas with high transmittance (≥50%) for detection purposes, and non-transmitting areas for structural support and insulation. This local quality differentiation allows simultaneous achievement of detection accuracy and mechanical/electrical performance.
Solution Approach 2:
The substrate is segmented into multiple functional regions: light transmitting areas (first light transmitting areas and third light transmitting areas) for detection, non-transmitting areas for structural support, and second light transmitting areas for combined functions. This segmentation enables each region to optimize its specific function without compromising overall performance.
2Reliability
If the conductive pad area is increased to improve electrical conduction, then the electrical conduction is improved, but the area occupied on the substrate is increased, reducing the space for light transmitting areas and detection capability
Solution Approach 1:
The conductive pads are strategically positioned within non-transmitting areas of the substrate, allowing them to have sufficient area for good electrical conduction without encroaching on light transmitting areas. The local quality of each region (conductive vs. transparent) is optimized independently.
3Measurement precision
If the substrate is made fully transparent to improve detection capability, then the detection capability is improved, but the structural strength and electrical insulation are deteriorated
Solution Approach 1:
The substrate implements local quality differentiation where non-transmitting areas provide structural strength and electrical insulation, while light transmitting areas (with transmittance ≥50%) enable detection. This resolves the contradiction by allowing each region to optimize its primary function.
Solution Approach 2:
The substrate is divided into functionally segmented regions: non-transmitting areas for structural support, first light transmitting areas for detection, and third light transmitting areas for trace observation. This segmentation allows the substrate to achieve both strength and detection precision simultaneously.
4Measurement precision
If the light transmitting areas are increased to improve detection capability, then the detection capability is improved, but the area available for conductive pads and traces is reduced
Solution Approach 1:
The substrate is segmented into distinct functional zones: non-transmitting areas housing conductive pads and traces, first light transmitting areas for detection, and third light transmitting areas for trace observation. This segmentation ensures sufficient space for both detection areas and conductive elements without mutual interference.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the reliability of the soldering process by enabling quick and accurate detection of connection imperfections, reducing product scrap and improving overall display quality.
Implementation Method 1
a substrate, wherein the substrate includes a plurality of first light transmitting areas... at least half area of a surface of the conductive pad facing the substrate is configured to be visible through the first light transmitting areas
Data Source
AI summary
The present application provides an array base plate and a backplane, which relates to the technical field of displaying. The array base plate includes: a substrate, wherein the substrate includes a plurality of first light transmitting areas; and a first conductive layer, located on the substrate and including a plurality of conductive-pad groups, and each of the conductive-pad groups including at least one conductive pad; at least half area of a surface of the conductive pad facing the substrate is configured to be visible through the first light transmitting areas.