Array Base Plate Conductor Layout for Uniform Micro LED Bonding
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Solution Overview
Problem
Current laser bonding methods for Micro LEDs, such as point spot, line spot, and plane spot bonding, face challenges with poor bonding efficiency and quality, particularly at the edge regions due to uneven temperature distribution during laser irradiation, leading to potential damage and reduced yield.
Innovation Solution
The array base plate design includes a first and second zone with adjusted conductor structures, where the second zone has a larger orthogonal projection area and improved heat absorption, reducing temperature differences between zones to enhance bonding yield and quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional laser bonding methods (point spot, line spot, plane spot) are used, then bonding process can be completed, but temperature distribution becomes uneven causing poor bonding quality and potential damage at edge regions
Solution Approach 1:
The patent applies local quality by creating different conductor structure configurations in different zones of the base plate. Specifically, the edge regions have increased conductor layer areas or additional conductor structures compared to center regions, allowing each zone to have optimized heat absorption characteristics suited to its specific bonding requirements, thereby achieving uniform temperature distribution across the entire base plate surface
Solution Approach 2:
The patent changes physical parameters of the conductor structures, including conductor area, conductor material composition, conductor layer thickness, and conductor pattern density, to optimize heat absorption in different zones. By adjusting these parameters, the patent compensates for uneven laser irradiation and achieves uniform temperature distribution across the base plate
2Productivity
If laser irradiation is applied to bond Micro LEDs, then bonding process is achieved, but edge regions suffer from temperature unevenness leading to potential damage and reduced yield
Solution Approach 1:
The patent implements local quality by designing zone-specific conductor structures where edge regions have enhanced conductor configurations (larger area, different patterns) compared to center regions. This localized optimization ensures that edge regions, which are more susceptible to temperature unevenness and damage, receive appropriate heat management, thereby improving overall bonding yield while protecting vulnerable areas
Solution Approach 2:
The patent applies preliminary anti-action by pre-configuring the conductor structures to counteract the anticipated harmful effects of uneven temperature distribution before laser bonding occurs. The conductor layers are designed in advance to absorb and redistribute heat, preventing edge region damage before it can occur during the bonding process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified conductor layout in the array base plate ensures more uniform temperature distribution, improving the bonding efficiency and quality of Micro LEDs by minimizing damage and enhancing overall yield.
Implementation Method 1
irradiating the light emitting element and the array base plate with a movable laser source to bond and fix the light emitting element with the array base plate
Implementation Method 2
heating it by laser irradiation
Implementation Method 3
The array base plate includes a first zone and a second zone... An area of an orthogonal projection of the conductor structure within the second zone on the substrate is greater than an area of an orthogonal projection of the conductor structure within the first zone on the substrate
Data Source
AI summary
The present application provides an array base plate, a display panel and a manufacturing method thereof, and a display apparatus. The array base plate includes a substrate and a plurality of conductor layers stacked on one side of the substrate, the plurality of conductor layers being provided with a conductor structure therein. The array base plate includes a first zone and a second zone, an area of an orthogonal projection of the first zone on the substrate is equal to an area of an orthogonal projection of the second zone on the substrate, and along a first direction, a distance between a center of the array base plate and the second zone is greater than a distance between the center of the array base plate and the first zone, the first direction being parallel to a plane where the substrate is located.