Array Resistor Side Electrodes for Semiconductor Module Bonding
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Solution Overview
Problem
The existing array resistors in semiconductor modules face bonding defects due to external impacts during handling, particularly those on the edge areas, leading to reduced bonding force and module reliability.
Innovation Solution
The semiconductor module design includes an array resistor configuration with strategically positioned end electrodes on the first and third side surfaces of the insulating substrate, bonded using solder, to enhance the bonding force between the array resistor and the module board, thereby improving the module's stability and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If array resistors are disposed on edge areas of the module board to increase integration density, then productivity and degree of integration are improved, but bonding force is reduced due to external impacts during handling
Solution Approach 1:
The patent extends electrodes from the traditional bottom surface only configuration to include side surfaces of the array resistor. Specifically, first electrodes are disposed on the first side surface, second electrodes on the third side surface, and third electrodes on the second side surface of the insulating substrate. This three-dimensional electrode arrangement increases the bonding area and distributes mechanical stress away from the vulnerable edge locations, thereby maintaining bonding force while enabling high integration density on the module board.
Solution Approach 2:
The patent employs a composite electrode structure where multiple electrode types (first electrodes on side surface, second electrodes on opposite side surface, third electrodes on adjacent side surface) are integrated with the insulating substrate. This composite configuration creates a robust bonding interface that resists external impacts better than conventional single-surface electrode arrangements, resolving the contradiction between integration density and bonding reliability.
2Device complexity
If conventional array resistors with bottom surface electrodes only are used, then device complexity is low, but bonding force is insufficient under external impacts
Solution Approach 1:
The invention transitions from a two-dimensional electrode arrangement (bottom surface only) to a three-dimensional configuration by adding electrodes on multiple side surfaces of the insulating substrate. First electrodes extend onto the first side surface, second electrodes onto the third side surface, and third electrodes onto the second side surface. This dimensional expansion increases the effective bonding area and provides mechanical reinforcement without substantially increasing device complexity.
Solution Approach 2:
The electrode system is segmented into multiple independent electrode groups positioned on different surfaces of the insulating substrate. This segmentation allows each electrode group to independently contribute to bonding force while distributing mechanical stress, achieving enhanced strength without requiring a completely complex redesign of the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the bonding force and reliability of the array resistor to the module board, reducing bonding defects and enhancing the overall performance and durability of the semiconductor memory module.
Implementation Method 1
a first solder contacting a first module pad of the plurality of module pads and one of the first electrodes; a second solder contacting a second module pad of the plurality of module pads and one of the second electrodes; and a third solder contacting a module pad of the plurality of module pads and the third electrode
Data Source
AI summary
A semiconductor module includes: a module board, a plurality of chips mounted on the module board, and a plurality of array resistors mounted on the module board, the plurality of array resistors including at least a first array resistor. The first array resistor may include a substrate comprising a top surface, a bottom surface opposite the top surface, and first to fourth side surfaces connecting the top surface to the bottom surface, the first and third side surfaces being opposite each other, and the second and fourth side surfaces being opposite each other; a plurality of first electrodes disposed on the first side surface of the substrate, each first electrode including at least a first portion on the first side surface of the substrate and a second portion on the bottom surface of the substrate; a plurality of second electrodes disposed on the third side surface of the substrate, each second electrode opposite a respective first electrode and including at least a first portion on the third side surface of the substrate and a second portion on the bottom surface of the substrate; for each pair of respective first and second electrodes opposite each other, a resistor disposed on the substrate between the respective first and second electrodes; and at least one third electrode disposed on the second side surface of the substrate, the third electrode including at least a first portion on the second side surface of the substrate and a second portion on the bottom surface of the substrate. Each of the first electrodes, the second electrodes, and the third electrode may be bonded to the module board.