Array Sensor Temperature Monitoring in Semiconductor EMI Environments
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Solution Overview
Problem
Conventional temperature monitoring methods in high electromagnetic interference (EMI) environments, such as those in semiconductor manufacturing, face challenges with noise in data collection and the need for multiple sensors to accurately measure temperature changes across components, especially in RF-powered systems where thermal responses affect process parameters and impedance.
Innovation Solution
An array detector system that generates a two-dimensional thermal image, allowing for simultaneous temperature monitoring of multiple components with a single sensor, enabling efficient temperature control and reduced alignment requirements, and adaptable to changing system conditions without hardware changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional point detectors or single-point IR detectors are used for temperature monitoring, then the system can measure temperature at a specific location, but it cannot accurately determine rapid temperature changes at that location because the measurement is averaged with surrounding temperatures
Solution Approach 1:
The patent divides the temperature monitoring field into multiple discrete zones, with each zone monitored by a dedicated detector element. This segmentation allows independent measurement of temperature changes in each zone without averaging effects, enabling accurate detection of rapid temperature changes at specific locations while maintaining spatial resolution across the entire monitored area.
2Adaptability or versatility
If multiple temperature sensors are deployed to monitor different components simultaneously, then comprehensive temperature coverage is achieved, but the system complexity and alignment requirements increase significantly
Solution Approach 1:
The patent combines multiple detector elements into a single integrated array sensor that simultaneously monitors multiple zones. This merging approach provides comprehensive temperature coverage across all components while reducing alignment complexity, as the array sensor can be positioned once to monitor the entire field rather than requiring multiple separate sensors to be precisely aligned on individual components.
Solution Approach 2:
The array sensor serves multiple functions simultaneously: it monitors temperature across the entire process chamber, identifies hot spots in real-time, tracks temperature changes over time, and provides spatial resolution for localized thermal events. This multi-functionality eliminates the need for separate monitoring systems for different components or locations.
3Ease of operation
If fiber optic sensors are used for remote temperature measurement, then non-contact temperature monitoring is achieved, but the system requires careful routing and control due to bend radius limitations
Solution Approach 1:
The patent replaces the mechanical fiber optic cable system with a stationary array sensor that directly detects infrared radiation from the process chamber. This substitution eliminates the need for flexible cable routing and bend radius considerations, as the sensor array is fixed in position and detects thermal radiation through the chamber window or opening without requiring physical connection to the measurement points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides precise temperature monitoring and control, reduces the need for multiple sensors, and allows for real-time system fingerprinting and troubleshooting, enhancing operational efficiency and adaptability in EMI environments.
Implementation Method 1
an array sensor to generate a two-dimensional image, the two-dimensional image including a plurality of pixels indicative of a temperature of a component
Data Source
AI summary
In some examples, an array sensor temperature control system is provided. The system may include an array sensor for generating a two-dimensional image, the two-dimensional image including a plurality of pixels or cells indicative of a temperature of a monitored component; a controller for controlling a heating or cooling device to adjust the temperature of the monitored component; and an array sensor controller activated by a power source and being in communication with the array sensor and controller.