Array Substrate Back-Side Via-Hole Pads Narrow Frame
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Solution Overview
Problem
The existing array substrate designs require a large periphery region for lead wire fan-out and pad structures, leading to a bulky frame, complex cutting processes, and poor splicing of display panels due to mismatched substrate dimensions and alignment issues.
Innovation Solution
The array substrate features conductive via-holes in the periphery region for lead wire connection to a back-side structure with lead wire pads, allowing for a narrower frame and synchronized cutting and alignment of substrates, with conductive via-holes and pads on the back side of the base enabling efficient electrical connections and reduced substrate size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead wires fan out in the periphery region and pads are provided at ends of fan-out lead wires, then electrical connection with driver IC is achieved, but width of periphery region must be large enough resulting in too large frame dimension
Solution Approach 1:
The patent moves the pad structures from the front surface periphery region to the back surface of the array substrate. Lead wires extend from the display region to the periphery region on the front surface, then connect to pads on the back surface through conductive via-holes. This dimensional transition from 2D planar layout to 3D spatial arrangement allows electrical connection without increasing frame width.
Solution Approach 2:
The patent embeds conductive via-holes within the substrate thickness to connect lead wires on the front surface to pads on the back surface. The via-holes are nested inside the substrate, utilizing the vertical dimension rather than expanding the horizontal periphery region, thus achieving connection without increasing frame dimension.
2Reliability
If certain space above pads is reserved for connecting driver IC or printed circuit board, then electrical connection is enabled, but substrate for aligning with array substrate cannot cover pad region resulting in different dimensions and complex cutting process
Solution Approach 1:
By relocating pads to the back surface of the array substrate, the patent eliminates the need for additional space above pads on the front surface. The aligning substrate can now cover the entire array substrate including periphery regions without obstruction, enabling synchronized cutting and simplifying the manufacturing process.
Solution Approach 2:
Instead of placing pads on the front surface where they obstruct substrate alignment, the patent inverts the conventional arrangement by placing pads on the back surface. This inversion allows the aligning substrate to fully cover the array substrate from the front, eliminating dimension mismatches and complex cutting requirements.
3Reliability
If edges of substrate and array substrate are not aligned due to different dimensions, then frame must be provided for splicing, but structure becomes complex and gaps between adjacent display panels increase resulting in poor splicing effect
Solution Approach 1:
The patent utilizes the back surface of the array substrate for pad placement, which allows the aligning substrate to extend to the same edges as the array substrate. This enables edge-to-edge alignment when splicing multiple display panels, eliminating the need for additional framing structures and reducing gaps between panels for improved splicing effect.
Data Source
AI summary
The present invention provides an array substrate, a manufacturing method thereof and a display panel. The array substrate comprises a base, the base comprises a display region for displaying and a periphery region outside the display region, a plurality of lead wires extending from the display region to the periphery region are provided on a first side of the base, a plurality of conductive via-holes are provided in the periphery region of the base, the conductive via-holes are electrically connected with the respective lead wires and provided with conductive material therein, the lead wires are electrically connected to a second side of the base through the respective conductive via-holes; a back-side structure electrically connected with the conductive via-holes is provided on the second side of the base, and the back-side structure comprises a plurality of lead wire pads electrically connected with the respective conductive via-holes.