Array Substrate Bending Material Layer Grooves
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Solution Overview
Problem
Current array substrates have poor bending performance, which hinders their ability to meet the bending requirements of modern display panels.
Innovation Solution
Incorporating a flexible substrate with a driving circuit layer and at least one bending material layer, where the bending material layer is strategically placed within grooves in the driving circuit layer to enhance flexibility and bending capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional array substrate structure is used, then the substrate provides structural support and electrical functionality, but the bending performance is poor
Solution Approach 1:
The patent introduces a bending material layer made of flexible polymer material between the substrate and the driving circuit layer. This flexible layer acts as a thin film that enables the substrate to bend while maintaining structural integrity, directly resolving the contradiction between needing structural support and achieving bending performance.
Solution Approach 2:
The patent creates a composite structure by combining the rigid substrate, the flexible bending material layer, and the driving circuit layer. This composite material approach allows the substrate to兼具 structural strength and bending flexibility, solving the contradiction between rigidity and flexibility.
2Reliability
If the array substrate is made flexible to meet bending requirements, then bending performance improves, but the structural stability and electrical connection reliability deteriorate
Solution Approach 1:
The flexible polymer bending material layer serves as a thin film that provides flexibility while maintaining structural stability. The layer is designed with specific thickness and material properties that allow bending without compromising the overall structural integrity or electrical connections.
Solution Approach 2:
The patent optimizes parameters such as the thickness of the bending material layer, its elastic modulus, and its positioning within the substrate structure to achieve the right balance between flexibility for bending and stability for structural integrity and electrical connections.
Data Source
AI summary
An array substrate is provided, which includes a flexible substrate, a driving circuit layer and at least one layer of a bending material. The driving circuit layer is disposed on a side of the flexible substrate, at least one bending material layer is disposed in the driving circuit layer. The bending performance of the array substrate is enhanced by providing at least one bending material layer in the driving circuit layer.