Array Substrate Bending Structure for Stress-Resistant Small Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Small-sized display devices, such as electronic watches, face manufacturing challenges due to stress concentration at the connection between the bending region and the display region, leading to cracks and reduced yield.
Innovation Solution
An array substrate design with a bending part that includes a first connecting segment and external expansion segments, which disperses stress intensity and enhances structural strength by increasing the width of the connecting part, thereby reducing the risk of stress concentration and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the bending part has a narrow width to reduce device size, then the device can be miniaturized, but stress concentration occurs at the connection points leading to cracks and reduced yield
Solution Approach 1:
The patent applies local quality by making the first connecting part wider than the bending body, creating a localized expansion at the connection point. This local structural enhancement increases the width specifically where stress concentration occurs, without increasing the overall device size. The wider connecting part disperses stress more effectively, preventing cracks while maintaining miniaturization elsewhere in the device.
Solution Approach 2:
The bending part is segmented into distinct components: the bending body and the first connecting part with different width characteristics. This segmentation allows each component to be optimized independently - the bending body remains narrow for device miniaturization, while the connecting part is widened to handle stress, thus resolving the contradiction between size and reliability.
2Reliability
If the connecting part width is increased to disperse stress, then stress concentration is reduced, but the device size increases
Solution Approach 1:
The patent implements local quality by confining the width expansion to only the first connecting part, while the bending body and other regions maintain their narrow dimensions. This localized approach ensures stress dispersion benefits are achieved without a proportional increase in overall device volume, as the expansion is restricted to a specific functional area rather than the entire device.
3Ease of manufacture
If the connecting part structure is simplified to reduce manufacturing complexity, then manufacturing becomes easier, but stress concentration risk increases
Solution Approach 1:
The patent applies parameter changes by modifying the width dimension of the first connecting part relative to the bending body. This is a straightforward geometric parameter change that can be easily implemented in manufacturing processes without requiring complex additional structures or materials. The width ratio between the connecting part and bending body is optimized to provide stress dispersion while maintaining manufacturing simplicity.
Data Source
AI summary
An array substrate, a display panel and a display device are provided by the present application. The array substrate includes a first body, a bending part and a second body arranged in a first direction. The first body is connected to the second body through the bending part. The bending part includes a bending body and a first connecting part arranged on a side of the bending body near the first body, the first connecting part includes a first connecting segment and at least one first external expansion segment located on at least one side of the first connecting segment in the second direction, the bending body is connected to the first body through the first connecting segment, and in the first direction, two ends of the bending body in the second direction are flush with two ends of the first connecting segment in the second direction, respectively.