Array Substrate Binding Region Protection for Cutting Fracture
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Solution Overview
Problem
The manufacturing process of display panels faces challenges due to the fragility of array substrates at the binding regions, leading to conchoidal fractures and notches during cutting, which reduces yield and is difficult to detect, causing progressive damage and product loss.
Innovation Solution
Incorporating a first and second transparent protection layer made of photoresist, with varying widths at edge and corner positions of the binding and strengthening regions, respectively, to enhance the strength of the array substrate and reduce breakage during cutting, while maintaining transparency to avoid blocking alignment and cutting marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the array substrate is cut at the binding region, then the display panel can be assembled, but the substrate is fragile and prone to conchoidal fractures and notches
Solution Approach 1:
A protection layer is formed on the array substrate before the cutting process. This protection layer is deposited in advance to cover the binding region, providing preliminary reinforcement to the fragile substrate areas before they undergo the cutting operation, thereby preventing conchoidal fractures and notches during manufacturing
Solution Approach 2:
The protection layer acts as an intermediary substance between the cutting tool and the array substrate. It serves as a mediator that absorbs or distributes the mechanical stress during cutting, preventing direct contact between the cutting force and the fragile substrate, thus avoiding fractures while still allowing the cutting process to proceed
2Reliability
If the protection layer covers the binding region, then substrate strength is improved, but alignment and cutting marks may be blocked
Solution Approach 1:
The protection layer is selectively formed only in the binding region of the array substrate, not across the entire substrate. This localized approach provides reinforcement exactly where needed (at the fragile binding region) while leaving other areas, including those with alignment and cutting marks, uncovered and visible, thus resolving the contradiction between protection and mark visibility
Data Source
AI summary
An array substrate, a display panel and a display device are provided. The array substrate includes a wiring layer and an insulation layer sequentially formed on a base substrate, and a side of the insulation layer of the array substrate distal to the wiring layer includes a binding region. The array substrate further includes a first protection layer located in the binding region of the array substrate, and at least a portion of the first protection layer is flush with an edge of the array substrate.