Array Substrate Electrode Structure for Uniform Liquid Crystal Cell Gaps
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Solution Overview
Problem
Small-size liquid crystal spatial light modulators face issues with poor cell gap uniformity due to the absence of spacers, leading to uneven image quality and insufficient modulating linearity, primarily because the pixel electrodes are uneven and require vias that disrupt the uniformity of the cell gap.
Innovation Solution
The array substrate design includes flat portions on the pixel electrodes to match the distance to the base substrate, with additional pixel electrodes covering the vias, ensuring uniformity and enabling full utilization of the pixel area for light transmission, thereby improving the uniformity of the cell gap and reducing uneven image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vias are used to electrically connect pixel electrodes to thin film transistors, then electrical connection is achieved, but the uniformity of the cell gap is degraded
Solution Approach 1:
The patent introduces a vertical compensation layer above the via structure to compensate for the height difference created by the via. This adds a new dimensional element (the compensation layer thickness) that balances the topography, allowing the pixel electrode surface to be substantially planar while maintaining electrical connection through the via.
2Manufacturing precision
If spacers are added to support cell gap, then cell gap uniformity is improved, but device complexity increases
Solution Approach 1:
The pixel electrode itself serves a dual function: it provides electrical connection through the via and simultaneously serves as the spacing element. The compensation layer integrated into the pixel electrode structure eliminates the need for separate spacer components, allowing the structure to support itself without additional elements.
3Reliability
If vias are formed in pixel electrodes, then electrical connection is enabled, but the aperture ratio is reduced
Solution Approach 1:
The via structure is localized to specific regions where electrical connection is needed, while the majority of the pixel electrode area remains intact for light transmission. The compensation layer is also localized only where needed to compensate for via height, preserving the overall aperture ratio by minimizing the impact on the light-transmitting area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the uniformity of the liquid crystal cell gap, improves light field regulation, and increases the aperture ratio of sub-pixels by utilizing the entire pixel area for light transmission, addressing the issues of uneven image quality and modulating linearity.
Implementation Method 1
refractive indexes of a liquid crystal layer is controlled by an external electric field, so that portions of the liquid crystal layer at different positions have different refractive indexes, a certain phase difference may be formed between the portions of the liquid crystal layer
Data Source
AI summary
An array substrate, a method for manufacturing an array substrate, a liquid crystal cell and a display apparatus are provided. The array substrate includes: a first base substrate; thin film transistors; a first planarization layer; a common electrode on a side of the first planarization layer away from the thin film transistors; a first dielectric layer on a side of the common electrode away from the first planarization layer; first pixel electrodes on a side of the first dielectric layer away from the common electrode; the first pixel electrodes are electrically connected to the thin film transistors in a one-to-one correspondence through first vias extending through the first dielectric layer and the first planarization layer; a surface of each first pixel electrode away from the first base substrate is provided with a first groove at least corresponding to a corresponding first via.


