Array Substrate Copper Layer Patterning by Chemical Plating
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Solution Overview
Problem
The electroplating process for manufacturing copper metal layers in display panels is energy-intensive and environmentally unfriendly due to high pollution and energy consumption, making it difficult to scale up for large-scale production.
Innovation Solution
A chemical plating method based on redox reactions is used to form a copper metal layer, which eliminates the need for electrification and etching, and involves forming an activating particle layer with a preset pattern on a buffer layer, followed by chemical plating to create a compact and conductive copper metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroplating is used to form copper metal layer, then copper layer can be formed with good conductivity, but the process consumes high energy and causes high pollution
Solution Approach 1:
The patent changes the fundamental parameter of the plating process from electrochemical (electroplating) to chemical (chemical plating). By using chemical plating with reducing agents to deposit copper from copper sulfate solution, the process eliminates energy consumption while maintaining copper layer formation and conductivity, directly resolving the contradiction between reliability and energy usage
2Reliability
If electroplating is used to form copper metal layer, then copper layer can be formed with good conductivity, but the process causes high pollution and environmental harm
Solution Approach 1:
The patent transforms the plating process from electrochemical to chemical methodology, using chemical reduction instead of electrical current. This parameter change eliminates the harmful byproducts associated with electroplating while preserving the ability to form conductive copper layers, thereby resolving the contradiction between reliability and environmental harm
3Reliability
If electroplating is used to form copper metal layer, then copper layer can be formed, but the process is difficult to scale up for large scale production
Solution Approach 1:
By changing from electroplating to chemical plating, the patent enables a process that can be more easily scaled up. Chemical plating does not require complex electrical equipment and can be performed in simple tanks, making it more suitable for large-scale production while maintaining copper layer formation quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces energy consumption and environmental impact while improving conductivity and adhesive force, enabling the production of energy-saving and environmentally friendly display panels.
Implementation Method 1
placing the glass substrate provided with the photoresist layer with the first preset pattern into an activation agent for activation, and forming an activating particle layer with the first preset pattern at a corresponding position where the activation agent is in contact with the photoresist layer
Implementation Method 2
performing chemical plating to form a first metal layer with the second preset pattern at a position corresponding to the activating particle layer with the second preset pattern
Data Source
AI summary
The present application discloses a array substrate, a manufacturing method of the array substrate, and a display panel, the manufacture procedure includes the following steps: sequentially forming a buffer layer and a photoresist layer on a glass substrate; placing the substrate into an activation agent for activation, and forming an activation liquid particle layer with a first preset pattern at a corresponding position where the activation agent is in contact with the photoresist layer, and forming an activation liquid particle layer with a second preset pattern at a corresponding position where the activation agent is in contact with the buffer layer; removing the photoresist layer and the activation liquid particle layer with the first preset pattern; and performing chemical plating to form a first metal layer at a position corresponding to the activation liquid particle layer with the second preset pattern in contact with the buffer layer.