Array Substrate Compensation Structure for Metal Breakage
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Solution Overview
Problem
The existing methods for fabricating array substrates often result in uneven surface of the source-drain metal film due to height differences, leading to breakage during the wet etching process, which causes failure in the array substrate formation.
Innovation Solution
A method involving the sequential formation of a first transparent conductive film and a source-drain metal film on a substrate, followed by forming a source-drain metal pattern and a compensation structure below it, which acts as a mask for precise alignment and compensates for potential breakage during wet etching, ensuring electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If patterns are formed on the substrate before forming source-drain metal film, then the fabrication process can proceed sequentially, but the surface of the source-drain metal film becomes uneven and breakage occurs during wet etching
Solution Approach 1:
The invention applies preliminary action by forming the compensation structure (transparent conductive film pattern) before forming the source-drain metal film. This compensation structure is created in advance to compensate for potential metal layer breakage, ensuring that when wet etching occurs, the underlying compensation structure maintains electrical connection even if the metal layer breaks.
Solution Approach 2:
The invention implements beforehand cushioning by creating a compensation structure that serves as a backup electrical pathway. This compensation structure is positioned below the source-drain metal pattern and provides redundant electrical connection, cushioning against the harmful effect of metal layer breakage during wet etching process.
2Ease of manufacture
If wet etching is used to form source-drain metal pattern, then the patterning process is simplified, but breakage of the metal layer occurs at turning points
Solution Approach 1:
The invention introduces an intermediary element - the compensation structure made of transparent conductive film - that mediates between the wet etching process and the final metal pattern integrity. This intermediary layer is formed first and provides a protective and compensatory function during the wet etching process, allowing the metal layer to be patterned without direct exposure of the underlying substrate to the etching chemicals.
3Reliability
If compensation structure is formed below source-drain metal pattern, then electrical connection is maintained during breakage, but the fabrication process becomes more complex
Solution Approach 1:
The compensation structure serves multiple functions: it acts as a mask during metal patterning, provides electrical connection backup during wet etching, and maintains overall device reliability. By making this single structure multi-functional, the invention reduces the need for additional separate components or processes, thereby limiting the increase in device complexity.
Data Source
AI summary
The present invention provides an array substrate, a method of fabricating the array substrate, and a display device. The method of fabricating the array substrate of the present invention comprises steps of: sequentially forming a first transparent conductive film and a source-drain metal film on a substrate; forming a source-drain metal pattern by performing a patterning process on the source-drain metal film; forming a pattern comprising a pixel electrode and a compensation structure that is provided below the source-drain metal pattern by performing a patterning process on the first transparent conductive film.