Flexible Array Substrate Groove Structure to Prevent Wire Crosstalk

The patent applies preliminary action by forming protrusions at the groove edges before filling with organic materials. These protrusions pre-establish boundaries that prevent material overflow and taper angle formation during the subsequent filling process, thereby eliminating the root cause of etching residue and line crosstalk while maintaining the bendability enhancement.

The protrusions formed at the groove edges create a preliminary anti-action by opposing the natural overflow tendency of organic materials. This preventive structure counteracts the harmful effect of material spreading beyond groove boundaries, thereby preventing the formation of taper angles that would otherwise cause metal wire etching residue and display abnormalities.

The patent applies segmentation by dividing the groove structure into distinct regions: the groove body for material filling and the protrusions at the edges as separate boundary elements. This segmentation allows the etching space to be minimized for high resolution while the protrusions provide additional space prevention, thereby eliminating etching residue issues even in narrow spacing conditions.

The patent applies local quality by providing enhanced structural features (protrusions) only at specific locations where grooves intersect with metal wires, rather than uniformly increasing etching space throughout. This localized approach maintains high resolution in non-critical areas while preventing etching residue at critical wire crossing points.