Array Substrate Data Line Merging for Touch Signal Integration
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Solution Overview
Problem
The existing manufacturing process of array substrates is complex and costly, leading to reduced yield and market competitiveness due to the need for additional metal layers and increased production costs.
Innovation Solution
A method for manufacturing an array substrate that simplifies the process by using two metal layers to form data lines, scan lines, and touch signal lines, with strategically placed through holes for electrical connections, reducing the complexity and cost while maintaining functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a third metal layer is added to form the touch signal line, then the touch signal line can be electrically connected, but the manufacturing process complexity and production cost increase
Solution Approach 1:
The patent combines the touch signal line with the data line by forming both conductors from the same second metal layer. The first data line and second data line are electrically connected through a connecting line in the second metal layer, eliminating the need for a separate third metal layer for the touch signal line. This merging of functions reduces manufacturing process complexity while maintaining electrical connectivity.
Solution Approach 2:
The second metal layer serves multiple functions: it forms the source, drain, connecting line, and touch signal line of the thin film transistor. By making the second metal layer multi-functional, the patent eliminates the need for the additional third metal layer that would otherwise be required specifically for the touch signal line, thereby simplifying the overall manufacturing process.
2Reliability
If a third metal layer is added to form the touch signal line, then the touch signal line can be electrically connected, but the production cost increases
Solution Approach 1:
The patent merges the touch signal line formation with the data line formation process by using the same second metal layer for both. This consolidation eliminates the need for an additional third metal layer deposition process, directly reducing production costs while ensuring proper electrical connection of the touch signal line.
Solution Approach 2:
The second metal layer is designed to perform multiple functions including forming the source, drain, connecting line, and touch signal line. This multi-functionality reduces the total number of metal layer deposition processes required, thereby lowering production costs while maintaining the necessary electrical connectivity for the touch signal line.
3Reliability
If additional metal layers are added, then the touch signal line can be formed, but the manufacturing yield decreases
Solution Approach 1:
The patent combines the formation of the touch signal line with the formation of data lines using the same second metal layer. This merging reduces the total number of metal layer deposition and patterning processes, thereby reducing the cumulative defect probability and improving manufacturing yield while ensuring proper formation of the touch signal line.
Solution Approach 2:
By designing the second metal layer to serve multiple functions (source, drain, connecting line, and touch signal line), the patent reduces the total number of manufacturing steps. Fewer steps mean fewer opportunities for defects and lower yield loss, while still achieving proper formation and electrical connection of the touch signal line.
Data Source
AI summary
A method for manufacturing an array substrate and an array substrate are provided, which include a first insulating for forming a gate, a scan line, a first data line, and a second data line of the thin film transistor, wherein the first data line and the second data line are located near both sides of the scan line, and are not electrically connected with the scan line, and a second insulating layer for forming a source, a drain, a connecting line, and a touch signal line of the thin film transistor, wherein the connecting line is configured to electrically connect the first data line with the second data line.