Array Substrate Disconnection Control Pattern for Under-cut Prevention
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Solution Overview
Problem
The existing array substrates for display apparatuses face reliability issues due to under-cuts between metal patterns and active patterns, leading to disconnection of connecting electrodes, which affects the performance and reliability of the display.
Innovation Solution
The array substrate incorporates a disconnection control pattern that overlaps the side surfaces of metal patterns, preventing under-cuts and ensuring continuous electrical connections between metal patterns, thereby enhancing the substrate's reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the active pattern is etched further than the drain electrode to improve connection reliability, then the connecting electrode may be disconnected due to under-cut
Solution Approach 1:
The patent introduces a disconnection control pattern that extends in the vertical dimension to overlap the side surface of the second metal pattern. This dimensional extension allows the connecting pattern to bridge across the under-cut region without being disconnected, as the connecting pattern makes contact with both the first and second metal patterns through the vertically extended disconnection control pattern.
Solution Approach 2:
The disconnection control pattern acts as an intermediary element between the first and second metal patterns. It provides a intermediate connection path that allows the connecting pattern to maintain electrical connection even when the etching creates an under-cut between the active pattern and drain electrode.
2Manufacturing precision
If the insulating layer is etched further than the data pattern to improve etching completeness, then the connecting electrode may be disconnected due to under-cut
Solution Approach 1:
The disconnection control pattern extends vertically to overlap the side surface of the second metal pattern, creating a dimensional buffer zone. This vertical extension ensures that even when the insulating layer is etched further than the data pattern, the connecting pattern can still maintain connection through the disconnection control pattern's overlapping structure.
Solution Approach 2:
The disconnection control pattern is designed beforehand to overlap the side surface of the second metal pattern, providing a pre-established safety margin. This overlapping structure cushions against the potential harm of excessive etching by maintaining connection integrity even when the insulating layer extends beyond the data pattern.
3Reliability
If additional patterns are added to prevent under-cut disconnection, then the device complexity increases
Solution Approach 1:
The disconnection control pattern serves multiple functions: it prevents under-cut disconnection, maintains electrical connection between metal patterns, and can be integrated with existing layer structures. This multi-functionality reduces the need for separate protective structures, thereby limiting the increase in device complexity.
Solution Approach 2:
The disconnection control pattern is merged with the existing metal pattern structure, specifically overlapping the side surface of the second metal pattern. This merging approach integrates the protective function into the existing design rather than adding completely separate structures, thus minimizing complexity increase.
Data Source
AI summary
An array substrate includes a base substrate and a contact part. The contact part is disposed on the base substrate. The contact part includes a first metal pattern, a disconnection control pattern and a connecting pattern. The second metal pattern is disposed on a layer different from the first metal pattern, the disconnection control pattern overlaps a side surface of the second metal pattern and a connecting pattern is formed on the first and second metal patterns and the disconnection control pattern and connects the first metal pattern with the second metal pattern.