Array Substrate Dummy Via Holes for Boundary Etch Uniformity
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Solution Overview
Problem
Existing display panel technologies face issues with non-uniform via hole formation in the boundary regions of the circuit area due to over-etching, leading to poor display performance and increased production costs.
Innovation Solution
The implementation of second via holes in a predetermined range outside the circuit region, matching the density, shape, and distribution of first via holes within the circuit region, without additional masking, to ensure uniformity and improve display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If via holes are formed in the boundary region using conventional etching methods, then the via holes can be created to connect conductive layers, but over-etching occurs leading to non-uniform via hole formation and poor display performance
Solution Approach 1:
The patent introduces a dummy pattern in the boundary region before via hole formation. This dummy pattern performs preliminary action by occupying space and preventing etching tool drift into the circuit region, thereby preventing over-etching and ensuring uniform via hole formation at the boundaries.
Solution Approach 2:
The dummy pattern acts as an intermediary element between the etching process and the circuit region. It mediates the etching process by providing a controlled termination point for the etch, preventing direct interaction between the etching tool and the circuit region boundaries, thus avoiding over-etching.
2Manufacturing precision
If additional masking processes are implemented to prevent over-etching in boundary regions, then via hole uniformity can be improved, but manufacturing complexity and production costs increase
Solution Approach 1:
The dummy pattern is merged with the existing interlayer dielectric structure and formed using the same etching process as the circuit region via holes. This combines the boundary region via hole formation with the main circuit region processing, eliminating the need for separate masking steps while maintaining via hole uniformity.
Solution Approach 2:
The dummy pattern is designed to be automatically formed and functional without requiring additional external control or masking processes. It self-services by inherently preventing over-etching through its geometric design and material properties, reducing the need for complex process control.
Data Source
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AI summary
Embodiments of the present disclosure relate to an array substrate, a display panel and a display device. The array substrate includes: a circuit region including a number of stacked conductive layers and an interlayer dielectric disposed between every two adjacent conductive layers, and first via holes are provided on the interlayer dielectric; and a boundary region disposed outside the circuit region, wherein second via holes for improving uniformity of the first via holes in the circuit region are disposed within a preset range of the boundary region close to one side of the circuit region, wherein the second via holes and the first via holes are disposed on the same interlayer dielectric.