Array Substrate Planarization for Flexible Display Electrode Gaps
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Solution Overview
Problem
Existing flexible display technologies face challenges in ensuring seamless integration and flexibility of components, particularly in the formation of sharp corners that can lead to gaps and breaks in the organic active layer, affecting conductivity and display quality.
Innovation Solution
The array substrate design includes an organic planarization layer with gentle slopes and specific overlaps to cover sharp corners, ensuring seamless integration of electrodes and active layers, and a manufacturing method that maintains flexibility and reduces process temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the organic planarization layer covers the source electrode and drain electrode completely, then the integration is improved, but the conductivity is reduced
Solution Approach 1:
The organic planarization layer is designed with different coverage in different regions: it covers the first gap between electrodes but leaves the electrode ends exposed. This local differentiation ensures both integration (by covering the gap) and conductivity (by exposing electrode ends for connection).
Solution Approach 2:
The organic planarization layer is divided into multiple portions arranged at intervals, with specific portions covering the first gap while other portions leaving electrode ends exposed. This segmentation allows simultaneous achievement of gap coverage and electrical connectivity.
2Ease of manufacture
If sharp corners are formed in the electrode structure, then the manufacturing is simplified, but gaps and breaks occur in the organic active layer
Solution Approach 1:
The organic planarization layer is formed beforehand to cover the sharp corners of the electrode structure. This preliminary action prevents the sharp corners from causing gaps and breaks in the subsequently formed organic active layer, while the electrode structure itself can be manufactured simply with sharp corners.
3Adaptability or versatility
If the organic planarization layer is made thin, then the flexibility is improved, but the coverage and protection are reduced
Solution Approach 1:
The thickness of the organic planarization layer is optimized to balance two opposing requirements: thin enough to maintain flexibility and flexibility, yet thick enough to provide adequate coverage and protection. The patent specifies a thickness range (50-200 nm) that achieves this balance.
4Manufacturing precision
If the side wall angle of the organic planarization layer is steep, then the manufacturing precision is improved, but the integration with the organic active layer is reduced
Solution Approach 1:
The side wall angle of the organic planarization layer is specifically controlled to be between 45°-75° relative to the substrate surface. This parameter optimization ensures both manufacturing precision and good integration with the organic active layer, as steeper angles would reduce coverage while shallower angles would compromise precision.
Data Source
AI summary
An array substrate, a manufacturing method therefor, a display panel and a display apparatus. The array substrate includes a base substrate; a first electrode layer and a first conductive layer successively provided on one side of the base substrate, the first conductive layer includes a source and a drain, a first gap being provided between the source and the drain; an organic planarization layer including a plurality of organic flat parts which are at least arranged inside the first gap, and the included angle between the side wall of an organic flat part close to the first gap and the face of the first conductive layer close to the organic planarization layer being less than the included angle between the side wall of the first conductive layer close to the first gap and the face of the first electrode layer close to the first conductive layer.