Array Substrate Electrode Protection Against Etching Corrosion
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Solution Overview
Problem
High pixel density in display devices, particularly in virtual reality products, leads to challenges in maintaining the integrity of electrodes during the manufacturing process, resulting in defects like dark spots due to over-etching and corrosion, which cause short circuits and fractures in the pixel and common electrodes.
Innovation Solution
The array substrate design includes a base substrate with a first electrode having a pad portion with intersecting surfaces, insulation layers with strategically formed via holes, and a second electrode connected through these holes, ensuring the second surface of the first electrode is in contact with the first insulation layer to protect against corrosion, and the manufacturing method involves precise formation of these layers to prevent recessing and fractures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the pixel density is increased to achieve high PPI display resolution, then the display resolution is improved, but the electrode structure becomes more susceptible to over-etching and corrosion during manufacturing
Solution Approach 1:
The patent applies preliminary action by forming a protective insulation layer on the electrode surface before the etching process. This insulation layer is prepared in advance to prevent over-etching and corrosion of the electrode during subsequent manufacturing steps, thereby maintaining electrode integrity while enabling high PPI display resolution
Solution Approach 2:
The patent introduces an intermediary substance (insulation layer) between the electrode and the etching environment. This intermediary layer acts as a mediator that protects the electrode from direct contact with corrosive etching solutions, preventing damage while allowing the etching process to proceed for pattern formation
2Reliability
If the via hole size is increased to ensure proper electrical connection, then the electrical connection is improved, but the risk of electrode recessing and film layer fracture increases
Solution Approach 1:
The patent applies preliminary action by forming the protective insulation layer before creating via holes. This pre-formed insulation layer protects the electrode edges during via hole etching, preventing electrode recessing that could lead to film layer fracture, while still allowing sufficient via hole size for reliable electrical connection
Solution Approach 2:
The patent implements beforehand cushioning by providing the insulation layer as a protective buffer before the via hole formation process. This cushioning layer absorbs the mechanical and chemical stress during etching, preventing direct damage to the electrode and reducing the risk of film layer fracture
Data Source
AI summary
An array substrate, a manufacturing method thereof and a display device are provided. The array substrate includes: a base substrate; a first electrode located on the base substrate and including a pad portion, the pad portion including a first surface and a second surface, the second surface being closer to the base substrate than the first surface; a first insulation layer located on the first electrode and including a first via hole; a second insulation layer located on the first insulation layer and including a second via hole; and a second electrode located on the second insulation layer; the second electrode is electrically connected with the first electrode at the pad portion through the first via hole and the second via hole, and an orthographic projection of the pad portion on the base substrate falls within an orthographic projection of the second via hole on the base substrate.