Array Substrate Electrostatic Shield Layer for GOA Circuit Protection
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Solution Overview
Problem
Display panels using gate-driver on array (GOA) technology are prone to static electricity damage during manufacturing and use, which can harm thin film transistors in the gate driver circuit.
Innovation Solution
An array substrate assembly with a grounded electrostatic shield layer is integrated between the substrate and the drive control circuit, covering the active layers of the thin film transistors, and optionally includes a black matrix, ground wire, and electrostatic connection bus to shield against static electricity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a grounded electrostatic shield layer is added between the substrate and the drive control circuit, then the thin film transistors are protected from static electricity damage, but the device structure becomes more complex
Solution Approach 1:
The electrostatic shield layer is merged with the black matrix layer, combining two functional layers into one. The black matrix serves both its traditional light-blocking function and the new function of providing electrostatic shielding, thereby reducing the number of separate layers and simplifying the overall device structure while maintaining protection against static electricity.
Solution Approach 2:
The black matrix is given multiple functions: it continues to block light in the display region while simultaneously serving as an electrostatic shield layer. This multi-functional design allows the same structural element to address both optical requirements and electrostatic protection needs, reducing device complexity.
2Reliability
If the electrostatic shield layer is formed as a continuous layer covering the entire drive control circuit, then comprehensive protection is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The electrostatic shield layer is segmented into multiple discrete regions, each corresponding to specific thin film transistor areas requiring protection. Rather than forming one continuous shield layer, the layer is divided into separate segments that can be independently patterned and formed, simplifying the manufacturing process while still providing comprehensive protection across the drive control circuit.
Solution Approach 2:
The electrostatic shielding is applied locally to specific regions where thin film transistors are located, rather than uniformly across the entire substrate. This localized approach allows the shield layer to be formed only where needed, reducing manufacturing complexity and material usage while maintaining effective protection for the critical transistor regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrostatic shield layer effectively protects the thin film transistors from static electricity, preventing damage and potentially reducing manufacturing costs by utilizing existing processes for the black matrix and electrostatic shield layer.
Implementation Method 1
a grounded electrostatic shield layer, wherein the electrostatic shield layer is located between the substrate and the drive control circuit
Data Source
AI summary
An array substrate assembly, a method of manufacturing the array substrate assembly, a display panel and a display apparatus are disclosed. The array substrate assembly includes a drive control circuit located on the substrate and configured for driving. The drive control circuit includes a plurality of thin film transistors each including an active layer. The array substrate further includes a grounded electrostatic shield layer. The electrostatic shield layer is located between the substrate and the drive control circuit, and an orthogonal projection of the electrostatic shield layer on the substrate covers orthogonal projections of at least the active layers of the plurality of thin film transistors of the drive control circuit on the substrate.