Array Substrate Ground Wire Layout for Narrow-Bezel ESD Protection
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Solution Overview
Problem
The narrow bezel design in panel displays weakens the antistatic capability, leading to potential electrostatic damage during production, which existing methods fail to effectively prevent.
Innovation Solution
An array substrate design featuring groups of bonding terminals connected via a first and second electrostatic protection wire, where the second wire guides static electricity to the first wire for balance and consumption, using metal wires with a fan-shaped arrangement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of marginal ground wire is increased to improve antistatic capability, then the antistatic capability is improved, but the device complexity and manufacturing difficulty increase due to narrow-bezel limitations
Solution Approach 1:
The ground wire structure is segmented into multiple parts: first ground wires extending from bonding terminals, second ground wires connecting to the first ground wires, and third ground wires forming a network. This segmentation allows the antistatic function to be distributed throughout the substrate rather than relying on a single wide marginal wire, solving the contradiction between antistatic capability and narrow-bezel constraints.
Solution Approach 2:
The patent transitions from a traditional single-dimension marginal ground wire approach to a two-dimensional network of ground wires distributed across the substrate. The first, second, and third ground wires create a planar network that provides antistatic protection throughout the display area, effectively utilizing the available space in narrow-bezel designs.
2Area of stationary object
If narrow-bezel design is implemented to minimize size and increase visual area, then the visual area is increased, but the antistatic capability is weakened
Solution Approach 1:
The ground wire network serves multiple functions: it provides antistatic protection, establishes electrical connections between bonding terminals, and creates a distributed protection scheme that works throughout the entire substrate. This multi-functionality allows the same structure to address both the connectivity needs and antistatic requirements without compromising visual area.
Solution Approach 2:
The third ground wires are configured to intersect and connect with first and second ground wires, creating a self-reinforcing network where the ground wire system itself provides the antistatic protection without requiring additional external components or structures. The network automatically distributes static electricity across multiple pathways.
3Reliability
If traditional antistatic methods (wrist straps, ion fans, grounded equipment) are used to prevent electrostatic damage, then the antistatic capability is improved, but the effectiveness is insufficient to avoid damages
Solution Approach 1:
The ground wire network is built into the substrate structure during manufacturing, providing antistatic protection before the product is even used or handled. The bonding terminals are pre-connected to the ground wire network, ensuring that electrostatic discharge pathways are already in place before any potential static electricity can cause damage during production or operation.
Solution Approach 2:
The ground wire network acts as an intermediary structure that provides a controlled pathway for static electricity to dissipate safely. Instead of relying on external antistatic equipment or operator behavior, the substrate itself incorporates a dedicated electrical pathway that mediates between potential static charge sources and the ground, ensuring reliable protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively protects the array substrate by guiding and balancing static electricity, preventing damage and improving yield without additional processing steps or costs.
Implementation Method 1
a second electrostatic protection wire located on the substrate, wherein the bonding terminals are connected to the first electrostatic protection wire through the second electrostatic protection wire
Data Source
Figure 1~2
Figure 3~4
AI summary
An array substrate and a manufacturing method thereof are provided. A plurality of groups of bonding terminals are formed on a substrate, a first electrostatic protection wire is formed on a marginal region of the substrate, and a second electrostatic protection wire is formed to connect the bonding terminals and the first electrostatic protection wire, so that static electricity on the bonding terminals is guided to the first electrostatic protection wire through the second electrostatic protection wire to balance and consume electricity charges, thereby achieving the purpose of effectively protecting the array substrate.