Array Substrate Corner Overheating via Segmented Fanout Wires
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Solution Overview
Problem
In narrow bezel and high-resolution display panels, the load on wire on array (WOA) is large during signal transmission, causing corners to heat up and affecting charging of thin-film transistors and the display effects and service life of the panels.
Innovation Solution
The design includes an array substrate with a base substrate, driver circuit, first and second chip-on-film structures, and transition modules, where the transition modules and array lines are disposed in the peripheral region of the base substrate, allowing the array lines to extend straight and reducing the formation of corner regions, thereby preventing overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire on array (WOA) is used to transmit gate driver signals from COF to gate lines, then signal transmission is achieved, but corners of the WOA become hot due to concentrated current flow
Solution Approach 1:
The patent divides the WOA structure into multiple segments by introducing fanout wires that branch out from the main WOA. This segmentation distributes the current flow across multiple paths, preventing concentration at corner regions and reducing heat generation while maintaining signal transmission functionality.
Solution Approach 2:
The patent transitions from a one-dimensional linear WOA structure to a two-dimensional network by adding fanout wires that extend in multiple directions. This dimensional change allows current to flow through multiple pathways, dispersing heat generation and eliminating the hot corner problem.
2Manufacturing precision
If narrow bezel and high-resolution display panels are designed, then display quality is improved, but the load on WOA increases causing overheating
Solution Approach 1:
The patent segments the heavy current load into multiple smaller loads by introducing fanout wires. Each fanout wire carries a portion of the total current, reducing the load on any single WOA line and preventing overheating while supporting high-resolution displays.
Solution Approach 2:
The fanout wires act as intermediary conductors between the COF and the gate lines. These intermediaries distribute the current load and provide additional transmission paths, enabling high-resolution displays without overloading the primary WOA structure.
3Reliability
If current is concentrated to pass through thin WOA lines, then signal transmission is achieved, but charging of thin-film transistors is affected and service life is reduced
Solution Approach 1:
The patent segments the current path into multiple fanout wire pathways, distributing the current load and reducing stress on individual lines. This segmentation prevents excessive heating that would degrade thin-film transistors, thereby extending display panel service life while maintaining signal transmission.
Solution Approach 2:
The patent changes the electrical parameters of the signal transmission system by adding parallel fanout wire paths. This increases the total conductive cross-section and reduces current density, lowering heat generation and protecting thin-film transistors from thermal degradation over time.
Data Source
AI summary
An array substrate and a display panel are disclosed. The array substrate includes a base substrate, a driver circuit, and a first chip-on-film structure. The array substrate further includes a plurality of transition modules and a plurality of array lines. A gate driver on array (GOA) circuit is separate from the driver circuit to be independently electrically connected to the transition modules and is connected to the base substrate through the array lines, so that problems of occurrence of corner regions in the array lines and heat likely to be produced in the corner regions can be avoided, and display quality of the display panel can be improved.