Array Substrate Fingerprint Signal Routing via Fourth Metal Layer
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Solution Overview
Problem
The integration of fingerprint identification units in display panels faces challenges in accommodating a growing number of signal lines within a narrow fan-shaped wiring area, particularly in small form factors, which affects the accuracy and efficiency of fingerprint identification.
Innovation Solution
The array substrate design includes multiple metal layers in both the display area and fan-shaped wiring area, with specific layers dedicated to data, touch, and fingerprint identification signal lines, allowing for efficient routing and reducing signal line density by distributing fingerprint identification signal lines across different metal layers, thereby reducing the overall height of the fan-shaped wiring area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of signal lines for fingerprint identification is increased to improve accuracy, then the fingerprint identification accuracy is improved, but the fan-shaped wiring area becomes more difficult to accommodate the signal lines within a narrow border
Solution Approach 1:
The patent introduces a fourth metal layer specifically in the fan-shaped wiring area to accommodate fingerprint identification signal lines. This vertical dimensionality change allows signal lines to be distributed across multiple layers (first, second, third, and fourth metal layers), effectively reducing the density and complexity in the narrow fan-shaped wiring area while supporting increased fingerprint identification accuracy through additional signal lines.
Solution Approach 2:
The patent segments the wiring area into distinct functional zones: a display area with first, second, and third metal layers for gate lines, data lines, and touch lines respectively; and a fan-shaped wiring area that includes a fourth metal layer dedicated to fingerprint identification signal lines. This segmentation allows each area to be optimized independently, reducing overall wiring complexity while supporting enhanced fingerprint identification capabilities.
2Adaptability or versatility
If more signal lines are routed in the fan-shaped wiring area, then the fingerprint identification functionality is enhanced, but the height of the fan-shaped wiring area increases
Solution Approach 1:
Instead of routing additional signal lines horizontally which would increase the height of the fan-shaped wiring area, the patent utilizes a vertical fourth metal layer. This allows multiple fingerprint identification signal lines to be accommodated within the same horizontal footprint by distributing them across different metal layers, thereby enhancing fingerprint identification functionality without increasing the overall height of the wiring area.
3Quantity of substance
If the density of signal lines in the fan-shaped wiring area is increased, then more fingerprint identification signal lines can be accommodated, but signal interference increases
Solution Approach 1:
The patent distributes fingerprint identification signal lines across multiple metal layers (first, second, third, and fourth metal layers) in the fan-shaped wiring area. This vertical separation reduces the horizontal density of signal lines in any single layer, thereby accommodating a greater total number of signal lines while minimizing signal interference through increased spatial separation between adjacent conductors.
Solution Approach 2:
The patent segments signal lines into different metal layers with specific functions: gate lines in the first metal layer, data lines in the second metal layer, touch lines in the third metal layer, and fingerprint identification signal lines in the fourth metal layer. This segmentation isolates different signal types in separate layers, reducing cross-talk and signal interference while enabling a higher total quantity of signal lines to be accommodated.
Data Source
AI summary
An array substrate and a display panel including the array substrate are provided. The array substrate has a display area and a fan-shaped wiring area. A first metal layer, a second metal layer, and a third metal layer are arranged in both the display area and the fan-shaped wiring area, and a fourth metal layer is arranged in the fan-shaped wiring area. In the display area, the first metal layer includes gate lines, the second metal layer includes data lines, and the third metal layer includes touch lines. Fingerprint identification signal lines are arranged in the fan-shaped wiring area and are electrically connected to fingerprint identification units arranged in the display area. The fourth metal layer arranged in the fan-shaped wiring area includes at least one of the fingerprint identification signal lines, which avoids too many fingerprint identification signal lines being arranged in the same layer with other signal lines.